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ASP-DAC 2018 : 23rd Asia and South Pacific Design Automation Conference


Conference Series : Asia and South Pacific Design Automation Conference
When Jan 22, 2018 - Jan 25, 2018
Where Jeju Island , Korea
Submission Deadline Jul 7, 2017
Notification Due Sep 11, 2017
Final Version Due Nov 6, 2017

Call For Papers

ASP-DAC 2018 is the 23rd annual international conference on VLSI design automation in Asia and South Pacific regions, one of the most
active regions of design and fabrication of silicon chips in the world. The conference aims at providing the Asian and South Pacific
CAD/DA and Design community with opportunities of presenting recent advances and with forums for future directions in technologies
related to Electronic Design Automation (EDA). The format of the meeting intends to cultivate and promote an instructive and productive
interchange of ideas among EDA researchers/developers and system/circuit/device designers. All scientists, engineers, and students who
are interested in theoretical and practical aspects of VLSI design and design automation are welcomed to ASP-DAC.
Areas of Interest:
Original papers in, but not limited to, the following areas are invited.
[1] System-Level Modeling and Design Methodology:
1.1. HW/SW co-design, co-simulation and co-verification
1.2. System-level design exploration, synthesis and optimization
1.3. Model- and component-based embedded system/software design
1.4. System-level formal verification
1.5. System-level modeling, simulation and validation
[2] Embedded System Architecture and Design:
2.1. Many- and multi-core SoC architecture
2.2. Reconfigurable and self-adaptive SoC architecture
2.3. IP/platform-based SoC design
2.4. Domain-specific architecture
2.5. Dependable architecture
2.6. On-chip memory architecture
2.7. Cyber physical system
2.8. Storage system architecture
2.9. Internet of things
[3] On-chip Communication and Networks-on-Chip:
3.1. On-chip communication network
3.2. Networks-on-chip
3.3. Interface and I/O design
3.4. Optical and RF on-chip communication
[4] Embedded Software:
4.1. Kernel, middleware and virtual machine
4.2. Compiler and toolchain
4.3. Real-time system
4.4. Resource allocation for heterogeneous computing platform
4.5. Storage software and application
4.6. Human-computer interface
4.7. System verification and analysis
[5] Device/Circuit-Level Modeling, Simulation and Verification:
5.1. Device/circuit/interconnect modeling and analysis
5.2. Device/circuit-level simulation tool and methodology
5.3. RTL and gate-leveling modeling, simulation and verification
5.4. Circuit-level formal verification
[6] Analog, RF and Mixed Signal:
6.1. Analog/mixed-signal/RF synthesis
6.2. Analog layout, verification and simulation techniques
6.3. Noise analysis
6.4. High-frequency electromagnetic simulation of circuit
6.5. Mixed-signal design consideration
6.6. Power-aware analog circuit/system design
6.7. Analog/mixed-signal modeling and simulation techniques
6.8. CAD for memory circuits
[7] Power Analysis, Low Power Design, and Thermal Management:
7.1. Power modeling, analysis and simulation
7.2. Low-power design and methodology
7.3. Thermal aware design
7.4. Architectural low-power design technique
7.5. Energy harvesting and battery management
[8] Logic/High-Level Synthesis and Optimization:
8.1. High-level synthesis tool and methodology
8.2. Combinational, sequential and asynchronous logic synthesis
8.3. Logic synthesis and physical design technique for FPGA
8.4. Technology mapping
[9] Physical Design:
9.1. Floorplanning, partitioning and placement
9.2. Interconnect planning and synthesis
9.3. Placement and routing optimization
9.4. Clock network synthesis
9.5. Post layout and post-silicon optimization
9.6. Package/PCB/3D-IC routing
[10] Design for Manufacturability and Reliability:
10.1. Reticle enhancement, lithography-related design and optimization
10.2. Resilience under manufacturing variation
10.3. Design for manufacturability, yield, and defect tolerance
10.4. Reliability, aging and soft error analysis
10.5. Design for reliability, aging, and robustness
[11] Timing and Signal/Power Integrity:
11.1. Deterministic/statistical timing and performance analysis and
11.2. Power/ground and package modeling, analysis and optimization
11.3. Signal/power integrity, EM modeling and analysis
11.4. Extraction, TSV and package modeling
11.5. 2D/3D on-chip power delivery network analysis and optimization
[12] Test and Design for Testability:
12.1. ATPG, BIST and DFT
12.2. Fault modeling and simulation
12.3. System test and 3D IC test
12.4. Online test and fault tolerance
12.5. Memory test and repair
12.6. Analog and mixed-signal/RF test
[13] Security and Fault-Tolerant System:
13.1. Security modeling and analysis
13.2. Architecture, tool and methodology for secure hardware
13.3. Design for security and security primitive
13.4. Cross-layer security
13.5. Fault analysis, detect and tolerance
[14] Emerging Technology:
14.1. New transistor/device and process technology: spintronic,
phase-change, single-electron etc.
14.2. CAD for nanotechnology, MEMS, 3D IC, quantum computing etc.
[15] Emerging Application:
15.1. Biomedical application
15.2. Big data application
15.3. Advanced multimedia application
15.4. Energy-storage/smart-grid/smart-building design and optimization
15.5. Datacenter optimization
15.6. Automotive system design and optimization
15.7. Electromobility

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