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AITIJ 2019 : Advances in Interconnect Technologies: An International Journal

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Link: http://airccse.com/aitij/index.html
 
When N/A
Where N/A
Submission Deadline Jan 12, 2019
Notification Due Feb 12, 2019
Final Version Due Feb 20, 2019
Categories    wireless   networking   modeling   simulation
 

Call For Papers

Advances in Interconnect Technologies: An International Journal (AITIJ)

Scope & Topics

Advances in Interconnect Technologies: An International Journal (AITIJ) invites original and significant contributions relating to the theory, design, performance and reliability of interconnect, including materials, analysis, modeling and simulation of interconnect. The journal proposes to stimulate the development of latest technology in industry and academia. High quality review papers and short communications are also acceptable.

Research areas suitable for publication include, but are not limited to the following fields:

Topics of interest include but are not limited to, the following

  • Emerging Materials
  • CNT/ Graphene Interconnects
  • Modeling and Simulation
  • Testing
  • RFIC
  • Optical Interconnects
  • Wireless Interconnects
  • Microstrip Lines
  • Analog and Mixed Signals
  • Dedicated Software and Systems for Developing Interconnect Technology
  • On-Chip and Off-Chip Interconnects
  • EMC/EMI
  • FPGA/ASICs
  • Fabrication Techniques
  • Neural Networks
  • Parasitics Issues
  • Optimization Techniques

Paper Submission

Authors are invited to submit papers for this journal through E-mail aitijjournal@airccse.com. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this Journal.

Important Dates

Submission Deadline: January 12, 2019
Authors Notification: February 12, 2019
Final Manuscript Due: February 20, 2019
Publication Date:Determined by the Editor-in-Chief

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