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AITIJ 2018 : Advances in Interconnect Technologies: An International Journal

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Link: http://airccse.com/aitij/index.html
 
When N/A
Where N/A
Submission Deadline Feb 3, 2018
Notification Due Mar 3, 2018
Final Version Due Mar 11, 2018
Categories    wireless   networking   modeling   simulation
 

Call For Papers

Advances in Interconnect Technologies: An International Journal (AITIJ)

Scope & Topics

Advances in Interconnect Technologies: An International Journal (AITIJ) invites original and significant contributions relating to the theory, design, performance and reliability of interconnect, including materials, analysis, modeling and simulation of interconnect. The journal proposes to stimulate the development of latest technology in industry and academia. High quality review papers and short communications are also acceptable.

Research areas suitable for publication include, but are not limited to the following fields:

Topics of interest include but are not limited to, the following

  • Emerging Materials
  • CNT/ Graphene Interconnects
  • Modeling and Simulation
  • Testing
  • RFIC
  • Optical Interconnects
  • Wireless Interconnects
  • Microstrip Lines
  • Analog and Mixed Signals
  • Dedicated Software and Systems for Developing Interconnect Technology
  • On-Chip and Off-Chip Interconnects
  • EMC/EMI
  • FPGA/ASICs
  • Fabrication Techniques
  • Neural Networks
  • Parasitics Issues
  • Optimization Techniques

Paper Submission

Authors are invited to submit papers for this journal through E-mail aitijjournal@airccse.com. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this Journal.

Important Dates

Submission Deadline: February 03, 2018
Authors Notification: March 03, 2018
Final Manuscript Due: March 11, 2018
Publication Date:Determined by the Editor-in-Chief

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