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TSP 2017 : 2017 40th International Conference on Telecommunications and Signal Processing (TSP) - IEEE R8 | IEEE Xplore® | SCOPUS


Conference Series : Telecommunications and Signal Processing
When Jul 5, 2017 - Jul 7, 2017
Where Barcelona, Spain
Submission Deadline Feb 24, 2017
Notification Due Apr 14, 2017
Final Version Due Apr 28, 2017
Categories    computer science   signal processing   security   networking

Call For Papers

2017 40th International Conference on Telecommunications and Signal Processing (TSP)
July 5-7, 2017, Barcelona, Spain

Final Submission Deadline: March 14, 2017 - 2PM CET

Technically co-sponsored by IEEE Region 8 (Europe, Middle East and Africa), IEEE Spain Section, IEEE Czechoslovakia Section, IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, and IEEE Croatia Section Communications Chapter.

The TSP 2017 Proceedings, containing presented papers at the Conference, will be submitted for indexing to the IEEE Xplore® Digital Library registered under IEEE Conference Record #41294, SCOPUS, Conference Proceedings Citation Index (CPCI) of Thomson Reuters, DBLP, and Google Scholar databases.

Authors of the best rated and presented papers will be invited for publishing in special issues of international journals.

Dear Colleague,

You are kindly invited to participate in the 2017 40th International Conference on Telecommunications and Signal Processing (TSP -, which will be held on July 5-7, 2017, in Barcelona, Spain.

The TSP Conference serves as a premier annual international forum to promote the exchange of the latest advances in telecommunication technology and signal processing. The aim of the Conference is to bring together both novice and experienced scientists, developers, and specialists, to meet new colleagues, collect new ideas, and establish new cooperation between research groups from universities, research centers, and private sectors from the whole Europe, America, Asia, Australia, and Africa.


We are glad to announce the following Keynote Speakers:

Invited Speech on Telecommunications

- Univ.Prof. Dr. Schahram Dustdar, IEEE Fellow - Full Professor and Head of the Distributed Systems Group, Institute of Information Systems, Vienna University of Technology (TU Wien), Austria

Invited Speech on Signal Processing

- Prof. Dr. Alejandro F. Frangi, PhD, IEEE Fellow - Professor of Biomedical Image Computing, CISTIB Center for Computational Imaging & Simulation Technologies in Biomedicine, Electronic and Electrical Engineering Department, The University of Sheffield, UK


TSP 2017 has opened Call for Papers for Regular Full Paper Submissions with a Final Extended Deadline set for March 14, 2017 - 2PM CET (5 more days). We look forward to your innovative contributions in any of the following areas:

AREA 1: Telecommunications

1. Information Systems
2. Network Services
3. Network Technologies
4. Telecommunication Systems
5. Modelling, Simulation and Measurement

AREA 2: Signal Processing

6. Analog Signal Processing
7. Audio, Speech and Language Processing
8. Biomedical Signal Processing
9. Digital Signal Processing
10. Image and Video Signal Processing

For more details please visit the Conference website at


The following Workshops will be co-located with the Conference:

- WS1: 7th SPLab Workshop of Signal Processing Laboratory at Brno University of Technology, Czech Republic
- WS2: 1st International Workshop on Recent Advances in Biometrics and its Applications organized by Assoc. Prof. Larbi Boubchir & Prof. Boubaker Daachi (both LIASD - University of Paris 8, France)
- WS3: 1st International Workshop of Advanced Terahertz Technologies and Applications (AT2P) organized by Prof. Lluis Jofre (Universitat Politecnica de Catalunya, Spain), Asst. Prof. Dr. Ayhan Yazgan (Karadeniz Technical University, Trabzon, Turkey), & Asst. Prof. Dr. Mehmet Unlu (Ankara Yildirim Beyazit University, Ankara, Turkey)


The following Special Sessions will be organized during the Conference:

- SS1: Special Session on Image Processing to Diagnose, Monitor, and Control organized by Prof. Dan Popescu & Dr. Loretta Ichim (both University Politehnica of Bucharest, Romania)
- SS2: Special Session on Photonic Networks and Services: Theory, Design, Modeling, and Applications organized by Dr. Josef Vojtech (CESNET a.l.e., Czech Republic) & Dr. Petr Munster (Brno University of Technology, Czech Republic)
- SS3: Special Session on Fractional-Order Systems; Analysis, Synthesis and Their Importance for Future Design by Assoc. Prof. Jaroslav Koton (Brno University of Technology, Czech Republic); et. al.


In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, to recognize outstanding technical contributions by students, as evidenced by the quality of papers, their presentations, and their technical excellence, the authors of the Best 3 Student Papers will be awarded during the conference by the Technical Committee. The Best Student Paper Award consists in a Certificate of Appreciation Plaque and an IEEE Student or IEEE Graduate Student membership for 2018.


The TSP 2017 is IEEE technically co-sponsored Conference organized in cooperation with sixteen universities:

- Brno University of Technology, Department of Telecommunications, Brno, Czech Republic
- Budapest University of Technology and Economics, Department of Telecommunications and Media Informatics, Budapest, Hungary
- Czech Technical University in Prague, Department of Telecommunication Engineering, Prague, Czech Republic
- Isik University, Department of Electrical and Electronics Engineering, Sile/Istanbul, Turkey
- Istanbul Technical University, Electronics and Communication Engineering Department, Istanbul, Turkey
- Karadeniz Technical University, Department of Electrical and Electronics Engineering, Trabzon, Turkey
- National Taiwan University of Science and Technology, Department of Electronic and Computer Engineering, Taipei, Taiwan
- Seikei University, Graduate School and Faculty of Science and Technology, Information Networking Laboratory, Tokyo, Japan
- Slovak University of Technology, Institute of Telecommunications, Bratislava, Slovak Republic
- Tecnocampus, Escola Universitaria Politecnica de Mataro, Mataro, Spain
- Technical University of Sofia, Faculty of Telecommunications, Sofia, Bulgaria
- Universite Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancee de Saint-Denis (LIASD), France
- University of Ljubljana, Laboratory for Telecommunications, Ljubljana, Slovenia
- University of Osijek, Faculty of Electrical Engineering, Computer Science and Information Technology Osijek, Croatia
- VSB - Technical University of Ostrava, Department of Telecommunications, Ostrava, Czech Republic
- West Pomeranian University of Technology, Faculty of Electrical Engineering, Szczecin, Poland


Organizing Committee:

- Honorary Chair: Miloslav Filka, Brno University of Technology, Czech Republic - Full Professor, TSP Conference Founder
- General Co-Chair: Norbert Herencsar, Brno University of Technology, Czech Republic - IEEE Czechoslovakia Section CAS/COM/SP Joint Chapter Chair, IEEE Senior Member
- General Co-Chair: Marcos Faundez-Zanuy, Escola Universitaria Politecnica de Mataró, Tecnocampus, Spain - Dean
- Publications Chair: Jaroslav Koton, Brno University of Technology, Czech Republic - IEEE Senior Member
- Student Paper Contest Chair: Jiri Hosek, Brno University of Technology, Czech Republic - IEEE Member
- Publicity & Social Media Chair: Aslihan Kartci, Brno University of Technology, Czech Republic - IEEE Graduate Student Member
- Finance Chair: Nandor Matrai, Asszisztencia Congress Bureau, Hungary - Managing Director
- Registrations Chair: Dora Kapitany, Asszisztencia Congress Bureau, Hungary - Project Manager

Steering Committee:

- Larbi Boubchir, Universite Paris 8, France - Associate Professor, IEEE Senior Member
- Izzet Cem Goknar, Isik University, Turkey - Institute of Science Director & Circuits and Systems (CAS) Society Turkey Chapter Chair, IEEE Life Fellow
- Ray-Guang Cheng, National Taiwan University of Science and Technology (NTUST), Taiwan - Full Professor, IEEE Senior Member
- Ismail Kaya, Karadeniz Technical University, Turkey
- Sridhar Krishnan, Ryerson University, Canada - Associate Dean, IEEE Senior Member
- Mario Kusek, University of Zagreb, Croatia, IEEE Member - IEEE Croatia Section Communications Chapter Chair
- Antonio Luque, University of Seville, Spain - IEEE Region 8 Vice Chair Member Activities 2017, IEEE Spain Section Chair 2016-2017, IEEE Senior Member
- Shahram Minaei, Dogus University, Turkey - Full Professor, IEEE Senior Member
- Ram M. Narayanan, The Pennsylvania State University, USA - Full Professor, IEEE Fellow
- Kimio Oguchi, Seikei University, Japan - Full Professor, IEEE Senior Member
- Serdar Ozoguz, Istanbul Technical University, Turkey - Full Professor, Associate Chair
- Jakub Peksinski, West Pomeranian University of Technology, Poland
- Hector Perez-Meana, National Polytechnic Institute, Mexico - Full Professor, IEEE Senior Member
- Vladimir Poulkov, Technical University of Sofia, Bulgaria - Dean, IEEE Senior Member
- Costas Psychalinos, University of Patras, Greece - Full Professor, IEEE Senior Member
- Markus Rupp, Vienna University of Technology, Austria - Dean, IEEE Fellow
- Zdenek Smekal, Brno University of Technology, Czech Republic - Full Professor, IEEE Senior Member
- Attila Vidacs, Budapest University of Technology and Economics, Hungary - Deputy Head of Department
- Miroslav Voznak, VSB-Technical University of Ostrava, Czech Republic - Department Chair, IEEE Senior Member
- Drago Zagar, University of Osijek, Croatia - Dean, IEEE Senior Member


Full Paper Submission: March 14, 2017 - 2PM CET (Final Extended Deadline)
Notification of Paper Acceptance: April 14, 2017
Final Paper Submission: April 28, 2017
Authors' Early Registration and Payment: May 14, 2017
Authors' Late Registration and Payment: May 24, 2017
Listeners' Registration: July 5, 2017



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TSP Organizers reserve the right to exclude a paper from distribution after the Conference (e.g., non-indexing in IEEE Xplore® and other databases) if the paper is not presented at the Conference. However, this paper will be distributed as part of the Conference proceedings issued on an USB drive.

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