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EMPC 2017 : European Microelectronics and Packaging Conference & Exhibition

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Link: http://www.empc2017.pl
 
When Sep 10, 2017 - Sep 13, 2017
Where Warsaw
Submission Deadline Mar 31, 2017
Final Version Due May 31, 2017
Categories    advanced packaging   interconnects   flexible electronics   reliability
 

Call For Papers

The 2017 European Microelectronics and Packaging Conference (EMPC) will be held for the first time in Poland, at
Warsaw University of Technology on September 10 - 13, 2017. The conference will include a plenary session, parallel symposia and will be accompanied by thematic exhibition.

ABSTRACTS ARE BEING REQUESTED IN THE FOLLOWING AREAS:

- Advanced packaging and interconnects
- Electronics components assembly and PCB solutions
- Materials and processes
- Printed, hybrid and flexible electronics
- Modeling, design test & reliability
- Functional systems (actuators, sensors, photovoltaics and related)

All submitted abstracts must represent original, previously unpublished work.
We look forward to welcome you to an inspiring and stimulating event.

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