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IEEE MCSOC 2017 : IEEE 11th International Symposium on Embedded Multicore/Many-core Systems-on-Chip

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Link: http://www.mcsoc-forum.org/
 
When Sep 18, 2017 - Sep 20, 2017
Where Korea University, Seoul, Korea
Submission Deadline Apr 15, 2017
Notification Due Jun 23, 2017
Final Version Due Jul 14, 2017
Categories    embedded systems   SOC   multiprocessors   multicore
 

Call For Papers

The IEEE 11th International Symposium on Embedded Multicore/Many-core Systems-on-Chip aims at providing the world’s premier forum of leading researchers in the embedded Multicore/Many-core SoCs software, tools and applications design areas for Academia and industries. Prospective authors are invited to submit paper of their works.Submission of a paper implies that at least one of the authors will have a full registration to the symposium upon acceptance of the paper.

Program Tracks

-Programming: Compilers, automatic code generation methods, cross assemblers, programming models, memory management, runtime management, object-oriented aspects, concurrent software.
-Architectures: Multicore, Many-core, re-configurable platforms, memory management support, communication, protocols, real-time systems, SoCs and DSPs, heterogeneous architectures with HW accelerators and GPUs.
-Design: Hardware specification, modeling, synthesis, low power simulation and analysis, reliability, variability compensation, thermal aware design, performance modeling, security issues.
-Interconnection Networks: Electronic/Photonic/RF NoC architectures, Power and energy issues in NoCs, Application specific NoC design, Timing, Synchronous /asynchronous communication, RTOS support for NoCs, Modeling, simulation, NoC support for MCSoC, NoC for FPGAs and structured ASICs, NoC design tools, Photonic components, Virtual fabrications, Photonic circuits, Routing, Filter design.
-Testing: Design-for-test, Test synthesis, Built-in-self-test, Embedded test for MCSoC.
-Packaging Technologies: 3D VLSI packaging Technology, Vertical Interconnections in 3D Electronics, Periphery Interconnection between Stacked ICs, Area Interconnection between Stacked ICs, Thermal management schemes.
-Real-Time Systems: real-time system design, RTOS, Compilation techniques, Memory/cache optimization, Interfacing and software issues, Distributed real-time systems, real-time kernels, Task scheduling, Multitasking design.
-Benchmarks: Parallel Benchmarks, Workload characterization and evaluation
-Applications: Bio-medical, Health-care, Computational biology, Internet of Things, Smart Mobility, Electric Vehicles, Aviation, Automobile, Military, and Consumer electronics.
Special Sessions

Important Dates
Paper submission: April 15, 2017
Acceptance notification: June 23, 2017
Camera ready paper: July 14, 2017
Symposium: September 18-20, 2017
Proceedings Publication and Indexing
MCSoC-2017 proceedings will be published by IEEE CS Press, which will be included in the Computer Society Digital Library CSDL and IEEE Xplore. All CPS conference publications are also submitted for indexing to EI’s Engineering Information Index, Compendex, and ISI Thomson’s Scientific and Technical Proceedings, ISTP/ISI Proceedings, and ISI Thomson.

Best Paper Award
IEEE MCSoC-17 features Best Paper Award to award authors with superior quality paper submission to this Symposium. The award includes a certificate. The authors of Best Paper Award will be recognized in the conference.

Special Issue
Authors of selected papers from IEEE MCSoC-17 Symposium will be invited to submit extended versions of their papers to journal/transaction for inclusion in special issues (TBD).

General Chairs
-Seon Wook Kim, Korea University, Korea
-Tae Hee Han, Sungkyunkwan University, Korea

Technical Program Chair
-Won Woo Ro, Yonsei University, Korea

Technical Program Vice Chairs
-Kenji Kise, Tokyo Tech, Japan
-Ji-Hoon Kim, Seoul Tech, Korea

Special Session Chairs
-Jang Woo Kim, POSTECH, Korea
Incheon Paik, the University of Aizu (UoA), Japan

Finance Chair
-Jae Wook Lee, Seoul National University, Korea

Registration Chair
-Yongjun Park, Hongik University, Korea

Publicity Chairs
-Joon-Sung Yang, Sungkyunkwan University, Korea
-Hiroshi Saito, the University of Aizu (UoA), Japan
-Akram Ben Ahmed, Keio University, Japan

Publication Chair
-Min Choi, Chungbuk National University, Korea

International connections
-Sébastien Le Beux, ECL, France
-Kuan-Ching Li, Providence University, Taiwan
-Gabriela Nicolescu, EPM, Canada

Steering Committee
-Tomohiro Yoneda, National Institute of Informatics, Japan
-Ahmed Louri, George Washington University, USA
-Toshiyaki Miyazaki, the University of Aizu, Japan
-Ian O’Connor, ECL, France
-Jiang Xu, Hong Kong Univ. Of Sciences and Technology, Hong Kong, SAR
-Abderazek Ben Abdallah, the University of Aizu, Japan (chair)

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