CALL FOR PAPERS
Journal of Systems and Software
Special Issue on Software Engineering Technology and Applications


Emerging application domains such as Brain Science, Cloud-based
Computing Systems, Data Science, Financial Technology (FinTech), Smart
Pervasive Systems are pushing existing software engineering principles
and technologies to their limits. Fortunately, software engineering
community is responding to these challenges with new theories and
technologies capable of handling increasing dynamism,
context-awareness and large-scale adaptation and evolution of
software, environments, and data.


This special issue solicits high-quality papers that address
significant and new software engineering and related system issues in
the emerging application domains (EADs). It should be noted that
papers applying existing research results to emerging application
domains or presenting research results in non-emerging application
domains are not within the scope of this special issue. On the other
hand, papers addressing the networking, security, privacy, and data
management aspects in the software development lifecycle in these
emerging domains will be within the scope.


Topics include, but not limited to, the following.

Foundations of software engineering and systems for various emerging
application domains.
Domain-specific infrastructure, platforms, and systems
Analysis, design, verification, and mining of dynamic or static
behavior of EAD systems and their repositories or social networks
websites
Software analytics in EADs
Open-source systems in EADs
Empirical studies and industrial case studies on software systems in EADs
Large-scale surveys/systematic literature review on the state-of-the-art



Submission Format and Guideline
--------------------------------------------

This special issue accepts two types of submissions. First, we welcome
manuscripts that have not been previously published or considered for
publication elsewhere. Second, we accept extensions of the best papers
published in COMPSAC 2016 in general and Symposium of Software
Engineering Technology and Applications (SETA) in
particular: https://www.computer.org/web/compsac2016/seta2016.

Each submission should target to present all the contents of the
article around 13000 words, including the abstract, references and
appendix (if any), with figures and tables counting as 250 words each.
The first section of each submission should clearly state the research
problems addressed and the proposed method as well as the novelty of
the proposed method and the validation results. If the submission is
an extended version of one or more published articles, a summary of
the published article(s) and the extended content included in the
submission should be clearly presented in the first section of the
submission. Each submission should include a comprehensive evaluation.

Submitted articles must be clearly written in excellent English and
contain original work. All the contents of the submission, including
the manuscript, a graphical abstract of the manuscript, and any
supplementary material should be submitted through the Elsevier
Editorial System (EES) available
at http://www.journals.elsevier.com/journal-of-systems-and-software/ .
The authors must select “SI: SETA2” when they reach the “Article Type”
step in the submission process. A detailed submission guideline is
available as “Guide for Authors”.

A submission extended from a previous conference version has to
contain at least 50% new technical contributions. Authors are
requested to attach to the submitted paper their relevant, previously
published articles and a summary document explaining the enhancements
made in the journal version.



Important Dates
--------------------
November 1, 2016 Deadline for paper submission
February 1, 2017: Notification of 1st round decision
May 1, 2017: Revised submissions due
July 1, 2017: Notification of 2nd round decision
August 1, 2017: Revised submissions due
September 30, 2017: Notification of final decision



Editor in Chief
H. van Vliet


Guest Editors

W.K. Chan, City University of Hong Kong, wkchan@cityu.edu.hk
Xiaodong Liu, Edinburgh Napier University, x.liu@napier.ac.uk
Hridesh Rajan, Iowa State University, hridesh@iastate.edu