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ISBA 2017 : IEEE International Conference on Identity, Security and Behavior Analysis

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Link: http://ieee-biometrics.org/isba2017/
 
When Feb 22, 2017 - Feb 24, 2017
Where New Delhi, India
Submission Deadline Oct 31, 2016
Notification Due Dec 10, 2016
Categories    biometrics   security   pattern recognition   behavior analysis
 

Call For Papers

The IEEE International Conference on Identity, Security and Behavior Analysis (ISBA 2017) is a unique conference series initiated by the IEEE Biometrics Council and its third edition will be held in New Delhi, India. It is a forum that brings together experts in biometrics, security, and human behavior to consider research issues and solutions that are robust, comprehensive, and broader than currently considered in each of these individual research areas. This conference serves to provide a new form for such broad areas defining human side of security and user behavior as well as social influence in the biometrics security.

Topics include, but are not limited to:

1. Biometrics, Identity Management, Person Re-identification, Social Biometrics, Multimodal Biometrics
2. Anti-Spoofing, Behavioral Biometrics, Biometric System Evaluation, Biometrics in Law Enforcement, Cybercrime
3. Information Security, User-centric Security, Mobile Device Security, Device Identification
4. Template Protection and Data Privacy, Privacy-preserving Computing, Usable Privacy and Security
5. Social and Criminal Network Inference, Surveillance Identification, De-identification, Detection and Tracking, Digital Forensics
6. Human Behavior Analysis, Human Activity Understanding, Behavior Modeling, Modeling Deception and Deceptive Intent, Predictive Analytics
7. Modeling the Interplay of Behavioral Modalities with Applications in Biometrics and Security

Submitted papers may not be accepted or under review elsewhere. Submissions may be up to eight pages in conference format (double blind reviewing). Papers accepted and presented at ISBA 201‚Äč7 will be published in conference proceedings and made available in IEEE Xplore library.

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