STMME 2016 : 2016 International Symposium on Technologies in Manufacturing and Mechanical Engineering (STMME 2016)--Ei &Scopus
Call For Papers
2016 International Symposium on Technologies in Manufacturing and Mechanical Engineering--STMME 2016
Dec. 28-30, 2016 ｜Hong Kong ｜http://www.stmme.org/
Call for Paper & Call for Participants
The purpose of the 2016 International Symposium on Technologies in Manufacturing and Mechanical Engineering (STMME 2016) is to bring together researchers, engineers and practitioners interested in the field of manufacturing and mechanical engineering. All accepted papers will be included in the conference proceeding, and indexed by EI Compendex, Scopus, CPCI and other databases.
Special sessions, dedicated to case-studies and commercial presentations, as well as tutorials dedicated to technical/scientific topics are also envisaged: companies interested in presenting their products/methodologies or researchers interested in holding a tutorial are invited to contact the conference secretariat.
KEYNOTE LECTURES& INVITED LECTURES
● Prof. Dan Zhang, York University, Canada
● Prof. Y. Lawrence Yao, Columbia University, USA
● Prof. Ian McAndrew, Embry Riddle Aeronautical University, UK
● Prof. WONG Chee How, Nanyang Technology University, Singapore
Each of these topic areas is expanded below but the sub-topics list is not exhaustive. Papers may address one or more of the listed sub-topics, although authors should not feel limited by them. Unlisted but related sub-topics are also acceptable, provided they fit in one of the following main topic areas:
1, Material Engineering
2, Manufacturing Processes and Systems
3. Materials Machining
4. Surface Engineering/Coatings
5. Laser Processing Technology
For topics, please visit: http://www.stmme.org/author.html.
1, Abstract submission: If you are interested in attending the conference and giving presentation, without publishing paper in the proceeding, you are welcome to submit the abstract to firstname.lastname@example.org.
2, Full paper submission: If you are willing to publish your paper in the proceeding, please send your unpublished English full paper to email@example.com.
Ms. Amber Cao