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RePa 2016 : Sixth International Workshop on Requirements Patterns (RePa’16)

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Link: http://www.utdallas.edu/~supakkul/repa16/cfp.html
 
When Sep 13, 2016 - Sep 13, 2016
Where Beijing, China
Submission Deadline Jun 20, 2016
Notification Due Jul 8, 2016
Final Version Due Jul 24, 2016
 

Call For Papers

Sixth International Workshop on Requirements Patterns (RePa’16)
Co-located with the 24th IEEE International Requirements Engineering Conference
Beijing, China - September 13, 2016
http://www.utdallas.edu/~supakkul/repa16/

Objective
The International Workshop on Requirements Patterns (RePa) workshop series is motivated by the desire to provide an open forum for researchers and practitioners to exchange ideas and experience, to develop pattern- based approaches to capturing, organizing, and reusing of all aspects of requirements engineering-related knowledge, from both process and product perspectives. Building on the success of the previous five editions of the International Workshop on Requirements Patterns (RePa’11 to RePa’15), the overall aim of RePa’16 is to promote and support the development and sharing of patterns, tools, methods, and repositories to facilitate pattern-based reuse at the requirements level.

Deadline: June 20 2016
Submission link: https://easychair.org/conferences/?conf=repa16

Accepted papers will become part of the workshop proceedings and will be submitted for inclusion into the IEEE Digital Library.

For more information, see the complete CFP at http://www.utdallas.edu/~supakkul/repa16/cfp.html
and the Program Committee at http://www.utdallas.edu/~supakkul/repa16/pc.html

======================================================
Julio Cesar Leite, Liping Zhao, Sam Supakkul, Sylwia Kopczyńska, Lawrence Chung (RePa Workshop Co-Chairs)

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