posted by user: Terppy || 3045 views || tracked by 15 users: [display]

CyberC 2016 : CyberC (Tech. Sponsored by IEEE CS, IEEE Big Data, IEEE SDN) China Oct. 13-14, 2016


Conference Series : Cyber-Enabled Distributed Computing and Knowledge Discovery
When Oct 13, 2016 - Oct 14, 2016
Where Chengdu, China
Submission Deadline Jul 15, 2016
Notification Due Aug 15, 2016
Final Version Due Sep 1, 2016
Categories    wireless   machine learning   big data   security

Call For Papers

We would like to invite you to participate in the 8th CyberC - International Conference on Cyber-enabled distributed computing and knowledge discovery, Chengdu, China, technically sponsored by IEEE, IEEE Computer Society, IEEE Big Data, IEEE SDN, IEEE CS Computer Society on Simulation, and IEEE ComSoc Technical SubCommittee on Big Data.

Date: October 13-14 2016
Web :
Submission Due Date : July 15 2016
EDAS Paper Submission :
Email Paper Submission :

Scopes : CyberC promotes the in-depth exploration of the most recent research and development findings in the field of big data, distributed computing, clouds, cyber security, pervasive computing, mobile computing, Internet of Things, and other cyber-relevant technologies. CyberC welcomes the participation of the industry to showcase and commercialize their relevant technology and products. Scientists, engineers, and students in the areas are encouraged to get involved.

ChengDu : The 8th CyberC will be hold in Chengdu, China, famous by Panda and spicy Sichuan dishes.

Summits : CyberC 2016 co-hosts Big Data and SDN/NFV forums that emphasize innovative and state-of-art big data & SDN/NFV academic research, industry development, showcases, technical transitions, and commercialization.

Tour s : One or two-day tours for the giant pandas, ancient alleys, and Jinsha Site Museum.

Co-hosted Workshops : Cyberc 2016 incorporates four workshops:
• Big Data Workshop 2016: The 4nd International Workshop on Big Data
• Security Workshop 2016: The 5th workshop on Cyber Security and Privacy
• SDN&NFV Workshop 2016: The 2st workshop on Software Defined Network and Network Function Virtualization
• Smart Sensor Workshop 2016: The 5th workshop on Smart Sensor Network


The CyberC 2016 Proceedings will be published by IEEE CPS. Full papers for CyberC 2016 must not exceed 10 pages of IEEE 2-column format, while short papers must not exceed 4 pages. Please visit the conference web site at for precise formatting and submission instructions.


Submission deadline for full (10-page) and short (4-page) papers: July 15 2016
Notification of acceptance: August 15 2016
Camera-ready and registration deadline: September 1 2016


Topics of interests:

Big Data and Information Discovery
Big data algorithms, models, and systems for big data
Machine learning and Artificial intelligence for big data
Big data hardware and software design, middleware and analytics
Cloud and high performance computing for big data
Big data retrieval, storage, query, communications, and database
Big data preservation, filter, provenance, and assurance
Big data security, protection, integrity and privacy standards and policies
Graph mining and opinion mining, and distributed data mining
Big data streaming, multimedia, stream, or web mining
Big data applications, image/multimedia data management
Database for Big data
Security and information assurance for Big Data
Cyber and Distributed Computing
Authentication, trust, privacy and other Cyber security issues
Parallel and distributed algorithms, resource allocation, load-balance, and management
Cloud computing, mobile cloud, mobility-aware cloud data/streams
SOA, web services, and mobile services (software, infrastructure, platform as a service)
Web services and internet computing
Web-caching, content delivery systems and data distribution systems
Distributed systems and applications, modeling language, and software engineering
Pervasive/ubiquitous computing and intelligence

5G and Mobile Computing
Wireless ad hoc networks, wireless mesh networks, networking theory and algorithms
Wireless embedded sensor systems, body sensor, new sensing capabilities & security
Cognitive radio and SDR
Future generation communications for 5G or 4G beyond (WiMAX, LTE)
Peer-to-peer network computing and overlaying networks
Directional antenna and networking
FDMA/OFDMA modulations, synchronization, and power optimization
Mobile IP and Internet technology
Key, attacking models, privacy, confidentiality & security in mobile wireless networks
Communication, services, middleware, and multimedia on wireless networks
QoS, reliability, performance, and communication theory
Wireless network simulations, implementation, and applications

Cloud Computing and Mobile Clouds
Autonomic, real-time and self-organizing clouds
Architectural models for public and private cloud computing
Cloud resource management and allocation
Utility models and service pricing
New parallel / concurrent programming models for cloud computing
Scientific computation and other applications in the cloud
Mobility modeling, management and measurement for mobile clouds
Mobile multimedia content delivery, transferring, and migration
Content delivery networks using storage clouds
User Experience and Cyber Security
Performance evaluation, measurement and optimization
Communications and network security
Information security, software security, system security, or applied cryptography
Tools, test-bed, simulations, and experimental environments
Collaborative and cooperative environments
QoS, Autonomic, reliability, and fault-tolerance

Program Committee
Honorable General Chairs
David Lu, AT&T Enterprise IT, USA
Chih-Lin I, China Mobile, China

Summit/Keynote Chairs
Chi-Ming Chen, AT&T Labs, USA
Yong Zhao, University of Electronic Science and Technology of China

Program Co-Chairs
Bin Xie, InfoBeyond Technology LLC, USA
Xiaolong Xu, Nanjing University of Posts and Telecommunications, China

Workshop Co-Chairs
Chi-Tsun (Ben) Cheng, The Hong Kong Polytechnic University, Hong Kong
Xiaolong Tang, InfoBeyond Technology LLC, USA
Mohammad S Khan, Texas A&M University-Kingsville, USA

Publicity Co-Chairs
Sammy Yang, Board Chinese Institute of Engineers, USA
Donghoon Lee, Korea University, Korea
Xiuhua Li, Beijing University of Posts and Telecommunications, China
Lijun Zhang, Chinese Academy of Sciences, China
Local Coordination Co-Chairs
Dongmei Sun, Beijing Jiaotong University, China
Hui Li, Xidian University, China

Steering Committee
Anup Kumar, (Chair) University of Louisville, USA
Chi-Ming Chen, AT&T Labs, USA
Chung-Min Chen, Iconectiv, USA
Alok Srivastava, Microsoft, USA
Jiangzhou Wang, University of Kent, UK

Financial Co-Chairs
Sanjuli Agrawal, Indiana University Southeast, USA
Yingbing Yu, Austin Peay State University, USA
Big Data Summit Co-Chairs
Chung-Min Chen, Iconectiv, USA
Jie Hu, Zynga Inc, USA

Secretary and Coordinator
Di Qiu, InfoBeyond Technology LLC, USA

Technical Program Committee
Ahmed Badi, Florida Atlantic University, USA
AlexandreKandalintsev, University of Trento, Italy
AtillaElci, Aksaray University, Turkey
Atta urRehman Khan, University of Malaya, Malaysia
Antonio Abramo, University of Udine, Italy
Benoit Hudzia, SAP Research, UK
Bo Jiang, Intel, USA
Chen Qian, University of Kentucky, USA
Chukwuemeka David Emele, University of Aberdeen, UK
Dejing Dou, University of Oregon, USA
Ding-Yaeh Hung, WuFeng University, Taiwan
Donglin Wang, New York Institute of Technology, USA
DorsafAzzabi, Canadian University of Dubai, UAE
Hsung-Pin Chang, National Chung Hsing University, Taiwan
Hufeng Zhou, Brigham and Women's Hospital and Harvard Medical School, USA
Hui Lu, Beihang University, P.R. China
Cheng Chang, National DongHwa University, Taiwan
Jing He, Kennesaw State University, USA
JorgDummler, Chemnitz University of Technology, Germany
Jun He, University of New Brunswick, Canada
Manar Ibrahim FawziHosny, King Saud University, Saudi Arabia
Man Ho Au, University of Wollongong, Australia
Maurizio Dusi, NEC Laboratories Europe, Germany
Min Wu, Oracle Corporation, USA
Mohammad Shoeb khan, University of Louisville, USA
Nicolas Sklavos, Technological Educational Institute of Patras, Greece
Nuno Vasco Lopes, University of Minho, Portugal
Omid Mahdi Ebadati E., THamdard University, India
RajdeepBhowmik, Cisco Systems Inc., USA
Ricardo Lopes Pereira, INESC-ID/Instituto Superior Técnico, Portugal
Ricardo Rodriguez, Technological University of Ciudad Juarez, Mexico
ShanmugasundaramHariharan, TRP Engineering College, India
Song Cui, Stanford University, USA
SubinShen, Nanjing University of Posts & Telecommunications, China
Timothy W. Hnat, University of Memphis, USA
Vic Grout, Glyndwr University, UK
Wei-Da Hao, Texas A&M University-Kingsville, USA
Weirong Jiang, Xilinx, USA
Xian-Hua Han, Ritsumeikan University, Japan
XinyuQue, IBM, USA
Xuewen (Sean) Gong, Huawei Technologies, China
YaserJararweh, Jordan University of Science and Technology, Jordan
ZhanlinJi, University of Limerick, Ireland
Zhefu Shi, Microsoft, USA
Zhengyu He, Google, USA

Paper Publication : All accepted papers will be published through IEEE CPS and you can find all our published papers (2009 – 2015) in IEEE Xplore, EI Complex, and EI Inspec.

Contact Email :

Join Us: Cyberc QQ group 426380304 (Strongly recommended for Chinese Authors - Currently 165 members) / Big Data QQ group 208385582 (Currently 210 members).

Distribution : You are welcome to distribute the CFP to your society or post on your web.

Related Resources

ICML 2017   34th International Conference on Machine Learning
IROS 2017   IEEE/RSJ International Conference on Intelligent Robots and Systems
DSAA 2017   The 4th IEEE International Conference on Data Science and Advanced Analytics 2017
IJCAI 2017   International Joint Conference on Artificial Intelligence
PAKDD 2017   The 21st Pacific-Asia Conference on Knowledge Discovery and Data Mining
WACV 2017   IEEE Winter Conference on Applications of Computer Vision
MLDM 2017   Machine Learning and Data Mining in Pattern Recognition
CDC 2017   56th IEEE Conference on Decision and Control
Humanoids 2017   2017 IEEE-RAS 17th International Conference on Humanoid Robotics
SI: Digital Forensics 2017   Call for Papers for Special Issue on Digital Forensics for IEEE S&P magazine