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IEEE-ISIEA 2009 : IEEE Symposium on Industrial Electronics and Applications


When Oct 4, 2009 - Oct 6, 2009
Where Kuala Lumpur, Malaysia
Submission Deadline May 18, 2009
Notification Due Jul 1, 2009
Final Version Due Aug 10, 2009
Categories    electronics   applications   networks   communications

Call For Papers

It is our great pleasure to announce the 2009 IEEE Symposium on Industrial Electronics and Applications (IEEE-ISIEA2009) to be held at Best Western Seri Pacific Hotel in Kuala Lumpur, MALAYSIA. on 4th-6th October 2009. The symposium will be organized to invite international delegates, to “Beautiful and Peaceful Malaysia” to share their latest research findings besides getting to know Malaysia.

IEEE ISIEA2009 will be organized and sponsored by IEEE Malaysia Section, IEEE Malaysia Power Electronics, Industrial Elecronics & Industrial Applications Joint Chapter and UiTM Student Branch. It has the Engineering in Medicine & Biology Chapter, Instrumentation & Measurement Chapter as technical co-sponsors, and are supported by IEEE Malaysia Women in Engineering. It is also co-organized by the Faculty of Electrical Engineering, Universiti Teknologi Mara, Shah Alam, Malaysia.

The Proceedings of ISIEA 2009 will be included in the IEEE Xplore database.

Authors are invited to submit full papers describing original research. Areas of interest includes, but are not limited to the following symposium tracks:

Electrical Drives & Applications :
Induction Machine & Synchronous Machines Applications, DC Motor Drives & Motion control, Drives in Traction and Automotive Applications, Special Machines, AC and DC drives modeling and simulation, micro machines, special application of machines and drives.

Power Electronics/Mechatronics & Applications :
AC-DC Converters, DC-DC Converters, DC-AC Inverters, AC-AC Converter, Multi-level converters, Resonant Converter, Soft-switched converter, Matrix Converters, Switch-mode power supplies, UPS, Power Electronic Applications, PWM Techniques, sensor integration and Active Filter Applications. Mechatronic systems, industrial robots, service robots, telerobotics and teleoperation, multi-robot systems, humanoid robots, Human-machine interactions, Intelligent automation and Micro-electromechanical systems (MEMS).

Biomedical & Computational Biology :
Biomedical Signal Processing., Biomedical Image Processing, Bioinformatics and Computational Biology; Systems Biology, Molecular and Cellular Biomechanics, Tissue Engineering, Biomaterials. Bio-Robotics, Surgical Planning and Orthopedics Biomechanics. Therapeutics and Diagnostic Systems, Devices and Technologies, Clinical Engineering., Healthcare Information Systems, Telemedicine, Pharmaceutical Applications, Other lifescience applications.

Computer Applications/Network and Communication Technologies :
Artificial neural network, Fuzzy systems, Genetic algorithm, Evolutionary computing, Machine learning, Data mining, Network protocols, Mobile computing, Mobile ad hoc networks, Mobile agents, Network architectures, Quality of services, Cross-layer design/ ptimization, Design and performance evaluation, Traffic control, Wireless systems, software engineering, parallel and high performance computation.

Instrumentation/Measurement/Signal Processing :
Image processing, Bio-image processing, Audio/video processing, Data processing, Automated test & diagnostics systems, Distributed measurement systems, Autonomous measurement systems, Non-invasive measurement systems, Virtual measurement systems, Sensors & transducers, A/D and D/A converters, Analog & mixed signal processing, Remote measurements, Measurement Applications, Digital signal processing theory and implementation.

Electronic Design & Applications :
Power devices and components, Power semiconductors, passive components and packaging technologies, smart power converters, Packaging, Thermal Management, EMI and EMC, Circuit & System Design, Test & Verification, Power integrated circuits (PIC), VLSI Systems and Applications, ASIC Design, FPGA Design and Coding, semiconductor technology, consumer electronics.

Submission Format :
Please submit full papers to the Conference website address All submitted papers should be in the form of PDF file and are to be limited to a maximum length of 6 pages (A4 size, single space, Times Roman of font size 10, two columns format), including figures, tables and references. It is recommended to use the template available from the website. Upon acceptance, authors will be required to register and present their papers. Papers will be published in the conference proceedings only if at least one of the authors is officially registered and presented. Each full registration covers a maximum of two papers. Student registration will cover a single-paper final submission and presentation. The authors must not indicate their names and affiliations in the body of the paper submitted. The authors only give their personal information during online submission. A peer review process will be used to evaluate all papers submitted for consideration Further information can be obtained from the following website :

Important Dates :
Deadline for Full Paper Submission (18th May 2009)
Notification of Acceptance (1st July 2009)
Deadline for Camera Ready Manuscript Submission (10th August 2009)
Deadline for Author’s Registration (14th August 2009)

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