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IJME 2017 : International Journal of Microelectronics Engineering

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Link: http://airccse.com/ijme/index.html
 
When N/A
Where N/A
Submission Deadline Feb 25, 2017
Notification Due Mar 25, 2017
Final Version Due Apr 3, 2017
Categories    simulation   nanotechnology   VLSI   microwave
 

Call For Papers

International Journal of Microelectronics Engineering (IJME)


Call for Papers


International Journal of Microelectronics Engineering invites high quality manuscripts in the research areas of analog and digital circuit design methodologies. This journal provides a worldwide, regular and comprehensive update on microelectronics engineering. Journal invites significant research and application papers in all the areas listed below. The comprehensive review papers covering recent developments will also be considered.

Topics of Interest :

  • Semiconductor Devices and Modelling
  • Mixed-Domain Simulation and Design
  • Microelectronics and VLSI Circuits
  • Deposition/Growth, Photolithography/Patterning
  • Device Simulation and Modelling of VLSI/CMOS/Unconventional Devices
  • Emerging and Advanced Fabrication Methodologies
  • Logic, Architectural and System Level Synthesis
  • Area, Power and Thermal Evaluation
  • New Device Structures
  • Nonconventional Devices: OTFTs, CNTFETs, Multigate FETs Tunnel FETs
  • Display Technology
  • Organic and Molecular Flexible Electronics
  • Embedded Systems
  • Emerging Devices and Circuits
  • Design of Semiconductor Memories
  • System on Chip Design
  • Testing, Design for Testability
  • Low Power VLSI Design
  • Quantum Computing and Nano-Technology
  • Micro Sensors and MEMS
  • Beyond CMOS Devices

Paper Submission:


Authors are invited to submit papers for this journal through E-mail : journalijme@airccse.org.Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this Journal.


Important Dates :

Submission Deadline:February 25, 2017
Authors Notification:March 25, 2017
Final Manuscript Due:April 03, 2017
Publication Date:Determined by the Editor-in-Chief

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