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ICIEM-Ei 2016 : SCOPUS, Ei--2016 International Conference on Innovative Engineering Materials (ICIEM 2016)

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Link: http://www.iciem.org
 
When Aug 20, 2016 - Aug 22, 2016
Where Nanyang Technological University, Singap
Submission Deadline Jun 30, 2016
Categories    robotics   mechanical engineering   manufacturing   physics
 

Call For Papers

2016 International Conference on Innovative Engineering Materials (ICIEM 2016)--SCOPUS, Ei Compendex

August 20-22, 2016 | Nanyang Technological University, Singapore

Official website: http://www.iciem.org

The conference will be held in Nanyang Technological University, Singapore during August 20-22, 2016.The aim of ICIEM 2016 is to present the latest research and results of scientists related to Innovative Engineering Materials topics. This conference provides opportunities for the different areas delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration. We hope that the conference results constituted significant contribution to the knowledge in these up to date scientific field.

All submissions will be peer reviewed by 2-3 reviewers.
All the registered and presented papers will be published in volume of Materials Science Forum
(ISSN: 1662-9752,Trans Tech Publications)

Indexed by Elsevier: SCOPUS, Ei Compendex (CPX).

Submission

ISCBI2016 is now accepting manuscript submissions.


Please submit your full paper to us: iciem@saise.org.

Conference Committee

International Advisory Committees

Prof. Tim White, Nanyang Technological University, Singapore
Prof. WANG John, National University of Singapore, Singapore
Prof. Min Wang,The University of Hong Kong, Hong Kong

Conference Committee Chairs

Prof. Dr. Mohd Hamdi Bin Abd Shukor, University of Malaya, Malaysia
Prof. Ir. Dr. Farid Nasir bin Haji Ani, Universiti Technologi Malaysia, Malaysia

Program Committee Chairs

Prof. CHOW Gan Moog, National University of Singapore, Singapore
Prof. Yu-Lun Chueh, National Tsing Hua University, Taiwan
Prof. Masashi Hasegawa, Nagoya University, Japan
Assoc. Prof. Yongsheng GAO, The Hong Kong University of Science and Technology, Hong Kong

Call for Paper

Materials Science and Engineering

Materials Properties, Measuring Methods and Applications

Methodology of Research and Analysis and Modeling

Materials Manufacturing and Processing

Conference Schedule

August 20, 2016: Registration and Collecting conference materials
August 21,2016: Keynote speeches and Oral presentation
August 22,2016: Academic investigation
Contact us
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MS. Echo Nie

Tel: +1-302-444-8432 (USA) / +86-18062000004 (China)
Email: iciem@saise.org
Website:http://www.iciem.org

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