posted by organizer: rf1437 || 857 views || tracked by 1 users: [display]

Congress MID 2016 : Congress Molded Interconnect Devices 2016

FacebookTwitterLinkedInGoogle

Link: http://www.3d-mid.de/2/congress-mid/index.html
 
When Sep 28, 2016 - Sep 30, 2016
Where Würzburg, Germany
Abstract Registration Due Feb 29, 2016
Submission Deadline Jun 30, 2016
Notification Due Apr 29, 2016
Final Version Due Jul 31, 2016
Categories    molded interconnect devices   electronics   packaging
 

Call For Papers

Latest serial applications in the MID technology and the increasing range of innovative manufacturing solutions for molded interconnect devices strongly emphasize the growing market success of this technology. Innovative assembly and equipment producers of MID technology record significant growth rates. The direct application of the electronic on various three-dimensional substrates offers versatile design and rationalization potentials for mechatronic systems.

Up-to-date information and expert discussions can set major impulses for the successful implementation of this innovative and interdisciplinary technology as well as for a stable assessment of the growth areas. The conferences about MID technology in the metropolitan region Nuremberg have established themselves as international most significant forum about this technology.

Experts of industry and research are invited, to present a paper on the topics listed below:
Innovation with MID, MID - Implementation and Realization, Integrated CAD / CAM Systems, Materials for MID, Plastics Processing, Metallization, Structuring of Circuit Paths, 3D Assembly, Quality Assurance, Future Trends

Important dates:
29.02.2016 Submission of abstracts
29.04.2016 Information about program selection
30.06.2016 Submission of full papers
15.07.2016 Review of full papers
31.07.2016 Submission of final papers
31.07.2016 Submission of presentation slides
28.-29.09.2016 International Congress MID 2016
30.09.2016 Technical Tours

Your contact person

'Sylvia Gerlach' for: organization, participants, location
e-mail: gerlach@3dmid.de; phone: +49 911 5302-9100

'Thomas Kuhn' for: program design, speakers, articles
e-mail: kuhn@3dmid.de; phone: +49 911 5302-9101

Research Association 3-D MID e.V.
Fuerther Str. 246b
D-90429 Nuremberg


Related Resources

CIARP 2017   22nd Iberoamerican Congress on Pattern Recognition
ATN 2017   Acta Technica Napocensis- Electronics and Telecommunications 2/2017
WCCI 2018   World Congress on Computational Intelligence
EEIJ 2017   Electrical Engineering: An International Journal
INFO 2018   XV International Congress of Information
DIPEWC 2017   The Second International Conference on Digital Information Processing, Electronics, and Wireless Communications
WorldCIS 2017   World Congress on Internet Security
ICCEE - Ei 2017   2017 10th International Conference on Computer and Electrical Engineering (ICCEE 2017)--Ei Compendex and Scopus
CyberSciTech 2017   The IEEE Cyber Science and Technology Congress 2017
CEC 2018   Congress on Evolutionary Computation