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CITS 2016 : 2016 International Conference on Computer, Information and Telecommunication Systems


When Aug 6, 2016 - Aug 8, 2016
Where Kunming, China
Submission Deadline Apr 8, 2016
Notification Due May 8, 2016
Final Version Due May 15, 2016
Categories    communications   computer networks   wireless communications   information security

Call For Papers

******Due to numerous requests deadline for paper submission to CITS 2016 has been extended to --April 8, 2016--. This will be a firm deadline******

CITS 2016 - 2016 International Conference on Computer, Information and Telecommunication Systems
Kunming, China, July 6-8, 2016
Sponsored by Xidian University, China and Yunnan Minzu University, China.
Technically co-sponsored by IEEE, IEEE Communications Society and SCS

The 2016 International Conference on Computer, Information, and Telecommunication Systems, CITS 2016, is an international forum for scientists, engineers, and practitioners to present their latest research and development results in all areas of Computer, Information, and Telecommunication Systems. The conference will feature tutorials, technical paper presentations, workshops and distinguished keynote speeches.

The conference will feature 6 tracks:
* Computer Systems Track
* Information Technology Track
* Web Technologies Track
* Networking Systems Track
* Telecommunications Systems Track
* Security Systems Track

All full paper submissions will be peer reviewed and evaluated based on originality, technical and/or research content/depth, correctness, relevance to conference, contributions, and readability. All accepted papers will be submitted for inclusion to IEEE Xplore digital library. Selected extended versions of accepted papers will be considered for Special Issues of Scholarly International Journals.

Papers should be written in English with a maximum paper length of 5 printed pages (10-point font, A4 size paper) including figures. For your submission you can use the standard IEEE Transactions templates for Microsoft Word or LaTeX formats found at: (Remember: A4 size)

Papers must be submitted in Portable Document Format (PDF) format, using the following EDAS link:

Important Notice
Papers are reviewed on the basis that they do not contain plagiarized material and have not been submitted to any other conference at the same time (double submission). These matters are taken very seriously and the IEEE will take action against any author who engages in either practice

Important Dates (preliminary)
Paper submission: April 8, 2016 (firm deadline)
Author notification: May 8, 2016
Camera-ready paper submission: May 15, 2016

General Chairs
Mohammad S. Obaidat, Fordham Univ., USA
Zan Li, Xidian Univ., China
Fei Gao, Yunnan Minzu Univ., China

Vice General Chair
Kuei-Fang (Leila) Hsiao, Ming-Chuan Univ., Taiwan

Senior Program Chair
Petros Nicopolitidis, Aristotle Univ., Greece

Program Chairs
Imad Mahgoub, Florida Atlantic Univ., USA
Feifei Gao, Tsinghua Univ., China
Bo Ai, Beijing Jiaotong Univ., China
Igor Bisio, Univ. of Genoa, Italy

Publicity Chairs
Moi Hoon Yap, Manchester Metropolitan Univ., UK
Seungmin (Charlie) Rho, Sungkyul Univ., Korea
Junzhao Du, Xidian Univ., China
Jingji Yang, Yunnan Minzu Univ., China
Essia Hamouda, California State Univ. Chico, USALei Shu, Guangdong Univ. of Petrochemical Technology, China
Der-Jiunn Deng, National Changhua Univ. of Education, Taiwan
Huiming Wang, Xi’an Jiaotong Univ., China

Publication Chairs
Daniel Cascado, Univ. of Seville, Spain
Chenxia Chang, Yunnan Minzu Univ., China

International Liaisons
Sang-Soo (Martin) Yeo, Mokwon Univ., Korea
Balqies Sadoun, Al-Balqa' Applied Univ., Jordan
Hong Ji, BUPT, China
Ching-Hsien (Robert) Hsu, Chung Hua Univ., Taiwan
Helen Karatza, Aristotle Univ., Greece

Registration Chairs
Lingling Kong, Yunnan Minzu Univ., China
Kuei-Fang (Leila) Hsiao, Ming-Chuan Univ., Taiwan

Finance Chairs
Yongtao Dong, Yunnan Minzu Univ., China
Kasim Al-Aubidy, Philadelphia Univ., Jordan

Antonio Bueno, Univ. of Girona, Spain
Wansheng Wang, Yunnan Minzu Univ., China

Technical Program Committee:

Please, visit for further details.

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