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IEEE MCSoC 2016 : IEEE 10th International Symposium on Embedded Multicore/Many-core Systems-on-Chip


When Sep 21, 2016 - Sep 23, 2016
Where Lyon, France
Submission Deadline Apr 30, 2016
Notification Due Jun 24, 2016
Final Version Due Jul 15, 2016
Categories    systems-on-chip   computer systems   network-on-chip   embedded systems

Call For Papers

The IEEE 10th International Symposium on Embedded Multicore/Many-core Systems-on-Chip aims at providing the world’s premier forum of leading researchers in the embedded Multicore/Many-core SoCs software, tools and applications design areas for Academia and industries. Prospective authors are invited to submit paper of their works.Submission of a paper implies that at least one of the authors will have a full registration to the symposium upon acceptance of the paper.
Program Tracks

Embedded Multicore/Many-core Programming: Compilers, automatic code generation methods, cross assemblers, programming models, memory management, runtime management, object-oriented aspects, concurrent software.
Embedded Multicore/Many-core Architectures: Multicore, Many-core, re-configurable platforms, memory management support, communication, protocols, real-time systems, SoCs and DSPs, heterogeneous architectures with HW accelerators and GPUs.
Embedded Multicore/Many-core Design: Hardware specification, modeling, synthesis, low power simulation and analysis, reliability, variability compensation, thermal aware design, performance modeling, security issues.
Embedded Multicore/Many-core Interconnection Networks: Electronic/Photonic/RF NoC architectures, Power and energy issues in NoCs, Application specific NoC design, Timing, Synchronous /asynchronous communication, RTOS support for NoCs, Modeling, simulation, NoC support for MCSoC, NoC for FPGAs and structured ASICs, NoC design tools, Photonic components, Virtual fabrications, Photonic circuits, Routing, Filter design.
Embedded Multicore/Many-core Testing: Design-for-test, Test synthesis, Built-in-self-test, Embedded test for MCSoC.
Embedded Multicore/Many-core Packaging Technologies: 3D VLSI packaging Technology, Vertical Interconnections in 3D Electronics, Periphery Interconnection between Stacked ICs, Area Interconnection between Stacked ICs, Thermal management schemes.
Embedded Multicore/Many-core Real-Time Systems: real-time system design, RTOS, Compilation techniques, Memory/cache optimization, Interfacing and software issues, Distributed real-time systems, real-time kernels, Task scheduling, Multitasking design.
Embedded Multicore/Many-core Benchmarks : Parallel Benchmarks, Workload characterization and evaluation
Embedded Multicore/Many-core Applications: Bio-medical, Health-care, Computational biology, Internet of Things, Smart Mobility, Electric Vehicles, Aviation, Automobile, Military, Consumer electronics, and Novel applications.

Important Dates

Paper Submission: March 11, 2016 --) April 30, 2016.
Acceptance notification: June 24, 2016
Camera ready paper: July 15, 2016
Symposium: September 21-23, 2016

Proceedings Publication and Indexing

MCSoC-16 proceedings will be published by IEEE CS Press, which will be included in the Computer Society Digital Library CSDL and IEEE Xplore. All CPS conference publications are also submitted for indexing to EI’s Engineering Information Index, Compendex, and ISI Thomson’s Scientific and Technical Proceedings, ISTP/ISI Proceedings, and ISI Thomson.
Best Paper Award

IEEE MCSoC-16 features Best Paper Award to award authors with superior quality paper submission to this Symposium. The award includes a certificate. The authors of Best Paper Award will be recognized in the conference.
Special Issue

Authors of selected papers from IEEE MCSoC-16 Symposium will be invited to submit extended versions of their papers to journal/transaction for inclusion in special issues (TBD).

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