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ESREF 2016 : 27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis


When Sep 19, 2016 - Sep 22, 2016
Where Halle (Saale), Germany
Submission Deadline Mar 7, 2016
Notification Due Apr 25, 2016
Final Version Due Jun 27, 2016
Categories    reliability   automotive

Call For Papers

Scope of Conference
ESREF 2016, the 27th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis will take place in Halle (Saale), Germany from September 19th to 22nd, 2016.
The conference continues to focus on recent developments and future directions in quality, robustness and reliability research of materials, components, integrated electronic circuits/systems and their nano-, micro-, power-, optoelectronics devices. ESREF provides the leading European forum for developing all aspects of reliability management and failure prevention for present and future electronics. ESREF 2016 will
have a specific focus on reliability issues in automotive electronics.

The following conference tracks and sessions are planned for ESREF 2016:
A: Quality and Reliability Assessment –Techniques and Methods for Devices and Systems
B: Semiconductor Reliability and Failure Mechanisms
C: Reliability and Failure Mechanisms in Packaging and Assembly
D: Progress in Failure Analysis Methods
E: Power Devices Reliability
F: Reliability and Failure Mechanisms of Wide Bandgap Devices
G: Reliability and Failure Mechanisms of special photonics and LED Devices
H: Reliability and Failure Mechanisms of MEMS and sensor systems
I: Reliability of automotive electronics from a systems perspective (CAM-Industry Workshop)
Additional workshops and tutorials are planned for the conference. Please follow our website to be informed about the continuous updates in the call for papers and in the conference organization.

Conference Topics
• Automotive electronics reliability (focus topic)
• Reliability of nano- and microelectronics for the connected world
• Reliability of power electronics for energy efficiency and industrial applications
• Reliability of photonics and MEMS devices
• Security and safety
• Innovative failure diagnostics and quality control
• Reliability concepts and modelling

Submission Guidlines
The deadline for the submission of abstracts will be in March 2016.
The 2-page abstract should include a five-line text summary, all images, figures and references, as well as the complete postal and E-Mail address of the corresponding author. Please note that abstracts and papers must be in English. Please indicate your preference for oral or poster presentation. Authors are requested to upload a file in Adobe Acrobat PDF. Further information is available at:

It is planned to publish the ESREF 2016 proceedings as a special issue of the scientific journal ”Microelectronics Reliability“ (Elsevier).

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