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TAIC PART 2016 : 11th Workshop on Testing: Academia-Industry Collaboration, Practice and Research Techniques


When Apr 11, 2016 - Apr 11, 2016
Where Chicago, IL, USA
Submission Deadline Feb 5, 2016
Notification Due Feb 26, 2016
Final Version Due Mar 4, 2016
Categories    software testing   industry collaboration   verification and validation   software quality

Call For Papers

+++ UPDATE: Deadline Extension +++

The submission deadline has been extended to February 5, 2016.

+++ Theme and Goals +++

TAIC PART is a workshop co-located with ICST 2016 that aims to forge collaboration between industry and academia on the challenging and exciting problem of real-world software testing. It is promoted by representatives of both industry and academia, bringing together industrial software engineers and testers with researchers working on theory and practice of software testing.

The goals of TAIC PART range from the articulation of research questions in the field of software testing and analysis to practical challenges faced in industry. The common theme is the discussion and advancement of approaches and methods for sustainable collaboration between academia and industry in software testing.

Tricentis BEST PAPER AWARD: The best paper presented at TAIC PART 2016 wins an iPad Air 2! Kindly sponsored by Tricentis - The Continuous Testing Company ( The best paper will be selected from the submitted regular papers based on the reviews by the program committee.

+++ Topics of Interest +++

TAIC PART invites submissions relevant to practice and research including

+ Industry experience reports: practical and generalizable insights into how to apply and extend existing approaches to software testing and analysis
+ Research methods for collaborative research: ways that industry and academia can collaborate to further knowledge on testing, verification and validation
+ Industrial challenges with real-world testing: describe a real-world software testing problem for which industry seeks help from academia or vice versa
+ Knowledge exchange between industry and academia: how can new results and knowledge be exchanged between the two partners

+++ Submission and Proceedings +++

+ Regular Papers (6 pages): Experience reports, research papers, longer challengebpapers (extension up to 10 pages may be possible on request)
+ Fast Abstracts (2 pages): Challenges in practice and research, work in progress, positions statements

Authors should submit a PDF version of their paper through the TAIC PART 2016 paper submission site: All accepted papers will be part of the ICST joint workshop proceedings published in the IEEE Digital Library.

+++ Organization and Contact +++

+ Rudolf Ramler, Software Competence Center Hagenberg, Austria (General Chair)
+ Michael Felderer, University of Innsbruck, Austria (Program Co-Chair)
+ Takashi Kitamura, National Institute of Advanced Industrial Science and Technology (AIST), Japan (Program Co-Chair)
+ Darko Marinov, University of Illinois at Urbana-Champaign, USA (Local Chair)

If you have any questions or require more information on TAIC PART 2016, please visit the web site or write to rudolf.ramler(at)

+++ Program Committee +++

Pekka Aho, VTT, Finland
Cyrille Artho, National Institute of Advanced Industrial Science and Technology, Japan
Jeff Ayars, Groupon, USA
Sigrid Eldh, Ericsson AB, Sweden
Emelie Engström, Lund University, Sweden
Vladimir Entin, OMICRON electronics, Austria
Elizabeta Fourneret, University of Franche-Comté, France
Vahid Garousi, Yusifoglu Atilim University, Turkey
Mark Harman, University College London, United Kingdom
Sam King, Twitter Inc., USA
Bogdan Korel, Illinois Institute of Technology, USA
Johann Krautlager, Airbus Helicopters, Germany
Shan Lu, University of Chicago, USA
Mika Mäntylä, University of Oulu, Finland
Stefan Mohacsi, Atos, Austria
Reinhold Plösch, Johannes Kepler University Linz, Austria
Mukul Prasad, Fujitsu, USA
Ina Schieferdecker, Fraunhofer FOKUS, Germany
Per Runeson, Lund University, Sweden
Haruto Tanno, NTT, Japan
Guilherme Horta Travassos, Federal University of Rio de Janeiro, Brazil
Tatsuhiro Tsuchiya, Osaka University, Japan
Peter Zimmerer, Siemens Corporate Technology, Germany

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