SMT Hybrid Packaging 2016 : International Exhibition and Conference for System Integration in Micro Electronics
Call For Papers
Interconnected factories, all-round communication, multifunctional systems: electronics manufacturing is facing great challenges in research, development and production.
As in previous years, I would sincerely like to invite you to SMT Hybrid Packaging from 26 – 28 April 2016 in Nuremberg. Benefit from the latest technologies and take this opportunity to exchange information with representatives of other sectors.
- What are the current requirements for electronic systems?
- Which new materials and technologies are available?
- How reliable can we produce and employ products?
- Which trends are expected?
Do you have answers to these questions? Then take a look at the Call for Tutorials for information about the current topic Areas:
1.2 Adhesive bonding
1.3 DIE and wire bonding, flip chip
1.4 Application techniques
2.Testing technologies for electronic assemblies
3.Reliability, quality and traceability of printed circuit boards
4.Process optimization and competitiveness
5.New materials, materials development, material efficiency
6.Assembly of electronic components
7.Packaging and system integration
8.Power electronics and high temperature PCB
9.3-D integration technologies and System in Package (SiP)
10.Design, simulation and development tools
12.Manufacturing logistics, equipment optimization and Overall Equipment Effectiveness (OEE)
13.Power LED systems and photonic boards
14.Environment, energy efficiency, disposal
15.Flex and rigid-flex PCB
16.Panel Level Packaging
18.Applications and technologies for Industry 4.0 in electronics
19.Process optimization via material flow logistics in SMD production
20.Molded (or Mechatronic) Interconnet Devices (3D-MID)
21.Generative production processes in electronics
A Production and practice
B Research and future developments
C Modelling and simulation