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Hot Chips 2015 : Hot Chips: A Symposium on High Performance Chips


When Aug 23, 2015 - Aug 25, 2015
Where Flint Center in Cupertino, CA
Submission Deadline Jul 1, 2015
Notification Due Jul 21, 2015
Categories    computer architecture   networks and interconnects   software   other technologies

Call For Papers

Call for Contributions
Hot Chips 27 will be held at the Flint Center in Cupertino, CA on Sunday, August 23, 2015 – Tuesday, August, 25, 2015 (Tutorials on Sunday).

Submit Here! Please read below for submission details.

Important Dates

Submission Due Acceptance Notification Final Version Due
Presentations April 6, 2015 May 1, 2015 July 15, 2015
Posters July 1, 2015 July 21, 2015 NA

Areas of Interest

General Purpose Processor Chips
High-Performance and Low-Power
Multi-Core and Highly-Reliable Systems
Mobile and Embedded Devices
SoC, Security, and DSP chips
Communications and Networking
Wireless LAN/WAN/PAN
Network and IO Processors
Other Chips
FPGAs and FPGA-Based Systems
Memory Technologies and Chipsets
Custom Chips for Emerging applications
Software for multi-Core and Heterogeneous Systems
Programming models, Runtime Systems
Compilers and Operating Systems
Performance, Power Debug and Evaluation
High Integrity Computation
Secure architectures
Design for validation and test
Other Technologies
Power and Thermal Management
Packaging and Testing
Display Technologies
On-Chip Optics & Sensors
Novel Computing Technologies
Submission Guidelines

Submissions must consist of the following and can be submitted here:

“Presentation” or “Poster”
Extended abstract (two pages maximum)
Presenter’s contact information (name, affiliation, job title, address, phone(s), fax, and email)
Indication whether you have submitted, intend to submit, or have already presented or published a similar or overlapping submission to another conference or journal.
Indication if you would like the submission to be held confidential.
Submissions are evaluated by the Program Committee on the basis of performance of the device(s), degree of innovation, use of advanced technology, potential market significance, and anticipated interest to the audience. Research and software contributions will be evaluated with similar criteria. To the extent that you are describing a product, please indicate its status – design, development, tape out, silicon, shipping, etc.

Presentation Guidelines

Presentations at HOT CHIPS are in the form of 30 minute talks using PowerPoint or PDF. Presentation slides will be published in the HOT CHIPS Proceedings. Participants are not required to submit written papers, but a select group will be invited to submit a paper for inclusion in a special issue of IEEE Micro.

Poster Guidelines

Poster submissions consist of 4 slides and a one-page summary.

Program related questions/comments?

Please email our Program Committee Co-Chairs at

Behnam Robatmili, Qualcomm
Rajeevan Amirtharajah, UC Davis

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