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ICDV 2015 : The 6th International Conference on Integrated Circuits, Design, and Verification (ICDV 2015)

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Link: http://www.uet.vnu.edu.vn/icdv
 
When Aug 10, 2015 - Aug 11, 2015
Where Ho Chi Minh city
Submission Deadline Jun 15, 2015
Notification Due Jul 20, 2015
Final Version Due Jul 31, 2015
Categories    VLSI   electronics   computer engineering   IOT
 

Call For Papers

CALL FOR PAPERS

The 6th International Conference on Integrated Circuits, Design, and Verification (ICDV 2015)

August 10 - 11, 2015 – Ho Chi Minh city, Vietnam (http://www.uet.vnu.edu.vn/icdv)

Organized in conjunction with VJMW 2015
Sponsored by
IEICE Vietnam Section,
IEICE Electronics Society Technical Committee on Integrated Circuits and Devices,
and IEICE Engineering Science Society Technical Committee on VLSI Design Technologies

Participating-Sponsored by
IEICE Electronics Society Technical Committee on Microwave Engineering,
IEEE SSCS Japan Chapter, IEEE SSCS Kansai Chapter, IEEE SSCS Vietnam Chapter,
and The Radio-Electronics Association of Vietnam (REV)



The IEICE International Conference on Integrated Circuits, Design, and Verification (ICDV) provides an annual forum for exchanging ideas, discussing research results, and presenting chips, circuit designs and applications in solid-state and semiconductor fields. Continuous scaling of the CMOS devices increases the number of transistors on a VLSI chip. It will soon reach the level of 10 giga transistors on a single chip, which is equivalent to the total neuron numbers in the human brain. This would certainly provide us a great opportunity for new applications and information processing. On the other hands, we now live in a world where every device is rapidly becoming connected. The era of the Internet of Things (IoT) changes drastically the way people and thinks communicate and work together in intelligent processes. To discuss utilizing the scaling advantages and their applications to the IoT era, we call for contributions about new proposal of application systems, VLSI architectures, and design methodologies as well as the technologies in the integrated circuits and devices field. We expect to this conference explores and stimulates the contributed researches to those subjects. The papers are solicited from prospective authors interested in the related fields.

The ICDV 2015 conference is sponsored by the IEICE Vietnam Section, the IEICE ICD technical group and the IEICE VLD technical group, hosted by HCM University of Sciences and VNU University of Engineering and Technology (VNU-UET), and will be held in Ho Chi Minh city, Vietnam. Further details on the conference, paper submission guidelines, and templates will be updated on the ICDV website at: http://www.uet.vnu.edu.vn/icdv

Paper Submission

Prospective authors are invited to submit full-length, six-page manuscripts, including figures, tables and references, to the official ICDV 2015 website. All papers will be handled electronically. Accepted and presented papers will be included in the conference proceedings published by the IEICE with ISBN (the copyright shall be assigned to the IEICE) and will be invited to re-submit an extension to high quality peer-reviewed journals: REV Journal on Electronics and Communications (JEC) and VNU Journal of Computer Science and Communication Engineering (JCSCE). Papers are solicited in the following categories, but are not limited to:

Digital integrated circuits and signal processing
Processors/ multiprocessors
Memory
Analog and mixed-signal circuits
RF integrated circuits and microwave engineering
Circuit technologies
Design experience with advanced design technology
Circuits/devices modeling, verification and testing
Reconfigurable architectures, FPGA-based designs
Embedded systems design
Applications related to integrated circuits and devices
Internet-of-Things applications

Important dates

Full manuscript submission: June 15, 2015
Notification of acceptance: July 20, 2015
Camera-ready submission: July 31, 2015

E-mail: icdv@vnu.edu.vn

General co-Chairs
Ngoc-Binh Nguyen, REV
Minoru Fujishima, Hiroshima Uni.
Yusuke Matsunaga Kyushu Uni.
Hideto Hidaka, Renesas
Huynh Huu Thuan, HCMUS

Technical program co-Chairs
Xuan-Tu Tran, VNU-UET
Takeshi Yoshida, Hiroshima Uni.
Hiroyuki Tomiyama Ritsumeikan Uni.
Cong-Kha Pham, Elec.-Comm. Uni.

Local Arrangement Chairs
Trong-Tu Bui, HCMUS
Duc-Hung Le, HCMUS

Treasurer
Makoto Takamiya, Uni. of Tokyo
Hai-Phong Phan, Hue Uni. of Sc.

Secretary
Hung K. Nguyen, VNU-UET
Cong-Kha Pham, Elec-Comm. Uni.

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