Hot 3D 2015 : 6th IEEE International Workshop on Hot Topics in 3D
Call For Papers
Call for papers
6th IEEE Int. Workshop on Hot Topics in 3D - Hot 3D
Torino, Italy, June 29, 2015 (in conjunction with ICME 2015)
Submission deadline: April 10, 2015
Paper Acceptance: April 30, 2015
Camera-ready paper due: May 15, 2015
The 3D research community is at a potentially revolutionary point. From one side, 3D display technology is at the verge of becoming widespread and reasonably priced, and that includes autostereoscopic displays. From another direction, increases in computational power – including powerful GPUs – and novel formats—including UHD-3D —have allowed an ever-increasing realism in 3D scene generation and display. 3D audio in now often tightly integrated with 3D environments. Haptic systems are also being tightly integrated within 3D systems. Quality evaluation of 3D systems itself is of great importance, and is also showing fast progress. Finally, new depth cameras, coupled with new 3D analysis and synthesis algorithms is close to enable commercial-quality 3D rendering of real scenes, instead of being restricted to synthetic scenes as in the past.
All these factors together create the “perfect storm”: an environment prone for an explosion of related technology and applications, with a speed of development that will not fit in the (slower) cycle of traditional conferences and journals. In other words, while appropriate venues for presenting research at advanced stages is plentiful, the 3D Multimedia community lacks an appropriate venue for receiving feedback during early or initial stages of the development of radical or potentially disruptive technology.
This is exactly the void that Hot3D tries to fill. After the enormous success of the previous Hot3D in Singapore (2010), Barcelona (2011), Melbourne (2012), San Jose (2013), Chengdu (2014), Hot3D 2015 is again expected to represent a premier venue, providing an environment for lively discussion of early-stage, potentially disruptive research.
Scope and format
Papers in all areas of Multimedia 3D are solicited. Early stage or preliminary results from potentially disruptive technology is particularly encouraged. Full papers (up to 6 pages) will be published in the ICME proceedings.
Additionally, and maybe most importantly, position papers are solicited for short presentation and discussion of preliminary work or ideas. Submit a proposal of up to 2 pages, with a decision expected up to 3 weeks after submission.
The 1-day workshop will be co-located with ICME, the flagship multimedia conference sponsored by four IEEE societies. The workshop will be a unique opportunity to interact with other researchers working on 3D Multimedia. With an environment designed to facilitate discussion and feedback in early stage research, as well as forge new collaboration, this is an event not to be missed.
Instructions (replace ICMEW2015 to ICME2015):
Jong-Seok Lee, Yonsei University, South Korea
Maria Martini, Kingston University London, UK
King Ngi Ngan, The Chinese University of Hong Kong
Eckehard Steinbach, Technical University of Munich, Germany
Touradj Ebrahimi, Switzerland
Dinei Florencio, USA
Aljoscha Smolic, Switzerland
Eckehard Steinbach, Germany
Murat Tekalp, Turkey
Anthony Vetro, USA
Cha Zhang, USA