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Hot 3D 2015 : 6th IEEE International Workshop on Hot Topics in 3D

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Link: http://www.lmt.ei.tum.de/Hot3D/
 
When Jun 29, 2015 - Jun 29, 2015
Where Torino, Italy
Submission Deadline Apr 10, 2015
Notification Due Apr 30, 2015
Final Version Due May 15, 2015
Categories    computer science   image processing   signal processing   communications
 

Call For Papers

Call for papers
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6th IEEE Int. Workshop on Hot Topics in 3D - Hot 3D

Torino, Italy, June 29, 2015 (in conjunction with ICME 2015)
http://www.icme2015.ieee-icme.org/workshops.php
http://www.lmt.ei.tum.de/Hot3D/

Submission deadline: April 10, 2015
Paper Acceptance: April 30, 2015
Camera-ready paper due: May 15, 2015

The 3D research community is at a potentially revolutionary point. From one side, 3D display technology is at the verge of becoming widespread and reasonably priced, and that includes autostereoscopic displays. From another direction, increases in computational power – including powerful GPUs – and novel formats—including UHD-3D —have allowed an ever-increasing realism in 3D scene generation and display. 3D audio in now often tightly integrated with 3D environments. Haptic systems are also being tightly integrated within 3D systems. Quality evaluation of 3D systems itself is of great importance, and is also showing fast progress. Finally, new depth cameras, coupled with new 3D analysis and synthesis algorithms is close to enable commercial-quality 3D rendering of real scenes, instead of being restricted to synthetic scenes as in the past.
All these factors together create the “perfect storm”: an environment prone for an explosion of related technology and applications, with a speed of development that will not fit in the (slower) cycle of traditional conferences and journals. In other words, while appropriate venues for presenting research at advanced stages is plentiful, the 3D Multimedia community lacks an appropriate venue for receiving feedback during early or initial stages of the development of radical or potentially disruptive technology.
This is exactly the void that Hot3D tries to fill. After the enormous success of the previous Hot3D in Singapore (2010), Barcelona (2011), Melbourne (2012), San Jose (2013), Chengdu (2014), Hot3D 2015 is again expected to represent a premier venue, providing an environment for lively discussion of early-stage, potentially disruptive research.

Scope and format
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Papers in all areas of Multimedia 3D are solicited. Early stage or preliminary results from potentially disruptive technology is particularly encouraged. Full papers (up to 6 pages) will be published in the ICME proceedings.
Additionally, and maybe most importantly, position papers are solicited for short presentation and discussion of preliminary work or ideas. Submit a proposal of up to 2 pages, with a decision expected up to 3 weeks after submission.
The 1-day workshop will be co-located with ICME, the flagship multimedia conference sponsored by four IEEE societies. The workshop will be a unique opportunity to interact with other researchers working on 3D Multimedia. With an environment designed to facilitate discussion and feedback in early stage research, as well as forge new collaboration, this is an event not to be missed.

Submission Guidelines
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Submission system:
https://cmt.research.microsoft.com/ICMEW2015/

Instructions (replace ICMEW2015 to ICME2015):
http://www.icme2015.ieee-icme.org/submission.php

Authors' guidelines:
http://www.icme2015.ieee-icme.org/authorguide.php

Organizing Committee:
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Jong-Seok Lee, Yonsei University, South Korea
Maria Martini, Kingston University London, UK
King Ngi Ngan, The Chinese University of Hong Kong
Eckehard Steinbach, Technical University of Munich, Germany

Steering Committee:
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Touradj Ebrahimi, Switzerland
Dinei Florencio, USA
Aljoscha Smolic, Switzerland
Eckehard Steinbach, Germany
Murat Tekalp, Turkey
Anthony Vetro, USA
Cha Zhang, USA

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