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ICEPT 2015 : The 16th International Conference on Electronic Packaging Technology


When Aug 11, 2015 - Aug 14, 2015
Where Changsha, China
Submission Deadline Mar 31, 2015
Categories    electronics   industrial electronics   electronics engineering   materials

Call For Papers

First call for papers

The 16th International Conference on Electronic Packaging Technology (ICEPT 2015)

August 11-14, 2015, Changsha, China
Conference Website:
Contact Emails: or

Important Dates
Abstract Submission Deadline: 2015-3-31(final extension)
Abstract Acceptance Notification: 2015-4-15
Full Paper Submission Deadline: 2015-5-15
Full Paper Acceptance Notification: 2015-6-20
Camera-ready Deadline: 2015-6-30

Inaugurated in 1994, the International Conference on Electronic Packaging Technology (ICEPT), hosted by the Chinese Institute of Electronics (CIE) and organized by the Electronic Manufacturing and Packaging Technology Society (EMPT) of CIE as well as several participating universities, has been successfully held 15 times in Beijing, Shanghai, Shenzhen, Xi’an, Guilin, Dalian and Chengdu. ICEPT offers attendees, including experts, researchers and engineers from industry and academia, numerous opportunities for discussion on state-of-the-art technologies in electronic packaging.

The 16th International Conference on Electronic Packaging Technology (ICEPT 2015) will be held in Changsha next August. Changsha, one of China's 20 most "economically advanced" cities, is the capital and largest city of Hunan province in south-central China, located on the lower reaches of the Xiang River, a branch of the Yangtze River. In the first millennium BC, Changsha was an urban center in the state of “Chu”. In the centuries following, Changsha has developed into the political, economic and cultural center of Hunan Province. Additionally, Changsha is well connected by roads, river, rail, and air transportation modes, and is a regional hub for industrial, tourist, and service sectors.

We are seeking broad participation from the areas including, but not limited to:
Advanced Packaging: BGA, CSP, Flip Chip; COB WLP, POP/PIP; TSV, 3D integration; high density substrate; and other advanced packaging and integration technologies.
System Integration: 3D integration by TSV, SIP, Test methodologies for 3D packaging and system level packaging.
Packaging Materials & Processes: Green materials, nano-materials, and other novel materials for packaging performance enhancement and cost reduction; various new packaging/assembly processes.
Packaging Design and Modeling: Novel packaging/assembly designs; methodologies for modeling, simulation and validation of electrical, thermal, optical and mechanical performance of various electronics packages; multi-scale and multi-physics modeling, process simulation.
Inter-connection technologies: High density inter-connection technologies; advanced bonding technologies; substrate solution for 3D packaging; non-conventional inter-connection technologies.
Advanced Manufacturing Technologies and Packaging Equipment: Packaging/assembly equipment (wafer thinning); test technologies; technologies for manufacturability and yield improvement, cost reduction and service performance improvement.
Quality & Reliability: Quality monitoring and evaluation; methodologies for accelerated reliability data collection and analysis, reliability modeling and life prediction, failure analysis and non-destructive diagnose.
Microwave and Power electronics Packaging: Components and modules for RF/mmW/THz systems; power devices; microwave device packaging; power electronics packaging; automobile electronics packaging.
Solid State Lighting Packaging & Integration: Methodologies for design, manufacturing and test of high power LED module; LED packaging/integration technologies and their applications in LCD, micro-projector, in-door lighting, street lamp, etc.
Emerging Technologies: MEMS, NEMS, and MOEMS; optoelectronics packaging; medical electronic device packaging; wearable/flexible electronics packaging; sensors, actuators, nano-devices, etc.

We welcome your abstracts and latest sound results. Please refer to conference website for submission instructions. Submissions will be evaluated on both their technical merit along with their potential to generate discussion and create community collaboration.
Submission website:

General Chair: Prof. Keyun BI
Technical Chair: Prof. Wenhui ZHU

General: or

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