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EMPC 2015 : 20th European Microelectronics Packaging Conference

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Link: http://www.empc2015.org
 
When Sep 14, 2015 - Sep 16, 2015
Where Friedrichshafen, Germany
Submission Deadline Jan 15, 2015
 

Call For Papers

Authors are invited to submit an abstract of 250 words (no figures, no tables, no formulas) that provides original and previously unpublished, non-confidential and non-commercial information. Please enter your abstract into the online conference system using the following link: https://www.conftool.com/empc2015/

Papers can cover a wide range of topics from the realms of:

Si and Glass Interposers & 2.5 / 3D Packaging
The Future of Packaging
Advanced Packaging, Interconnects & Assembly / Application Fields
Materials & Processes
Modeling, Design, Test & Reliability

A prize for both the best paper and the best poster presentation will be awarded by the program committee.

In case of questions please contact our conference office at empc@mcc-pr.de

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