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HWISE 2009 : Fifth IEEE International Workshop on Heterogeneous Wireless Networks

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Link: http://www.cs.iupui.edu/~durresi/hwise2009/
 
When May 26, 2009 - May 29, 2009
Where Bradford, UK
Submission Deadline Nov 30, 2008
Notification Due Dec 10, 2008
Final Version Due Dec 22, 2008
Categories    wireless
 

Call For Papers

Fifth IEEE International Workshop on Heterogeneous Wireless Networks
HWISE 2009
http://www.cs.iupui.edu/~durresi/hwise2009/

In conjunction with The 23rd IEEE International Conference on
Advanced Information Networking and Applications - AINA 2009
http://www.inf.brad.ac.uk/~iawan/aina/home.php


===============
IMPORTANT DATES
===============

Submission deadline: Extended to November 30, 2008

Authors Notification: December 10, 2008

Author Registration: December 15, 2008

Final Manuscript: December 22, 2008

Workshop dates: May 26 - 29, 2009



Heterogeneous Wireless Networks (HWISE) , supported by recent
technological advances in low power wireless communications
along with silicon integration of various functionalities, such as
sensing, communications, intelligence and actuation are emerging
as a critically important disruptive computer class based on a new
platform, networking structure and interface that enable novel,
low cost, high volume applications, such as nuclear, biological
and chemical attack detection and protection; home automation;
battlefield surveillance and environmental monitoring.

We encourage contributions describing innovative work on HWISE. The
topics of interest include but are not limited to:

* Applications of HWISE
* Scalable Architectures
* Communication protocols
* Security
* Information processing
* QoS solutions
* Interoperability
* Operating systems
* Simulations, experimental studies, and testbeds
* Network Management


For further information, please contact the workshop co-chairs.


==========================
PAPER SUBMISSION GUIDELINE
==========================

Submit a full paper not more than six pages (IEEE Computer Society
proceedings Manuscripts: two column, single-spaced), including
figures and references, using 10 font size, and number each page.
You can find instructions for authors how to format the IEEE CS
proceedings Manuscripts, at the following web page:

http://www.computer.org/portal/site/cscps/

Contact author must provide the following information:
paper title, authors' names, affiliations, postal address, phone,
fax, and e-mail address of the author, about 200 word abstract,
and five keywords.

Prepare your paper in PDF file (Adobe format), and submit it
to program co-chairs by email:


Arjan Durresi, Email: durresi@cs.iupui.edu

Leonard Barolli, Email: barolli@fit.ac.jp


Accepted papers will be given guidelines in preparing and submitting
the final manuscript(s) together with the notification of
acceptance.

Proceedings of the Workshops will be published by IEEE Computer
Society Press. Based on quality and referee reviews, the best papers
selected by HWISE 2009 program committee out of papers accepted for
presentation at HWISE 2009 will be further considered for publication
in International Journals.



================================
HWISE 2009 ORGANIZING COMMITTEE
================================


Co-Chairs:

Arjan Durresi, Indiana University Purdue University Indianapolis, USA
Leonard Barolli, Fukuoka Institute of Technology, Japan


Advisory Chairs:

Makoto Takizawa, Tokyo Denki University, Japan
Raj Jain, Washington University in St. Louis, USA


Program Committee:

Mohammed Atiquzzaman, Oklahoma University, USA
Sriram Chellappan, Missouri University of Science and Technology, USA
Koji Chida, NTT, Japan
Tomoya Enokido, Tokyo Denki University, Japan
Mukul Goyal, University of Wisconsin Milwaukee, USA
Qijun Gu, Texas State University - San Marcos, USA
Frank Hsu, Fordham University, USA
Tesuya Izu, Fujitsu Laboratories, Japan
Akio Koyama, Yamagata University, Japan
Michiharu Kudo, IBM Japan, Japan
Jiandong Li, Xidian University, China
Yao Liang, Indiana University Purdue University Indianapolis, USA
Chunlei Liu, Troy University, USA
Jianhua Ma, Hosei University, Japan
Sanjay Kumar Madria, Missouri University of Science and Technology USA
Jelena Misic, University of Manitoba, Canada
Vojislav Misic, University of Manitoba, Canada
Masakatsu Morii, Kobe University, Japan
Masakatsu Nishigaki, Shizuoka University, Japan
Vamsi Paruchuri, University of Central Arkansas, USA
Elhadi Shakshuki, Acadia University, Canada
Yoshitaka Shibata, Iwate Prefectural University, Japan
Yuji Suga, Canon, Japan
Kaoru Sugita, Fukuoka Institute of Technology, Japan
Keisuke Takemori, KDDI Co., Japan
Christian Tchepnda, France Telecom R&D, France
Ryuya Uda, Tokyo University of Technology, Japan
Wenye Wang, North Carolina State University, USA
Hsiao-Chun Wu, Louisiana State University, USA
Fatos Xhafa, Polytechnic University of Catalonia, Spain
Dong Xuan, Ohio State University, USA
Hiroshi Yoshiura, University of Electro-Communications, Japan
Xukai Zou, Indiana University Purdue University Indianapolis, USA

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