posted by user: BERYL || 1531 views || tracked by 2 users: [display]

FOMCD 2014 : 2014/ 2nd International Conference on Future Optical Materials and Circuit Design (FOMCD 2014)

FacebookTwitterLinkedInGoogle

Link: http://www.fomcd-conf.com/
 
When Dec 24, 2014 - Dec 25, 2014
Where Wuhan, China
Submission Deadline Nov 25, 2014
Notification Due Nov 20, 2014
Final Version Due Nov 25, 2014
Categories    future   optical   materials   circuit design
 

Call For Papers

FOMCD 2014 has been entered in publisher website (出版社官方网站)

FOMCD series provides a forum for accessing to the most up-to-date and authoritative knowledge from both industrial and academic worlds, sharing best practice in the field of Energy and Environmental. A key aspect of this conference is the strong mixture of academia and industry. This allows for the free exchange of ideas and challenges faced by these two key stakeholders and encourage future collaboration between members of these groups.

The first of this conference series (FOMCD 2012) was held on December 27-28, 2012, Xiamen, China with the participation of Scientists from the Asia-Pacific region, Europe and the United States. All accepted papers from this conference were published on Advanced Materials Research journal and had been indexed into EI Compendex, Thomson ISTP and Elsevier SCOPUS databases.

Following the success of FOMCD 2012, the 2014/ 2nd International Conference on Future Optical Materials and Circuit Design (FOMCD 2014), will take place on December 24-25, 2014, Wuhan, China. The conference program covered invited, oral, and poster presentations from scientists working in similar areas to establish platforms for collaborative research projects in this field. This conference will bring together leaders from industry and academia to exchange and share their experiences, present research results, explore collaborations and to spark new ideas, with the aim of developing new projects and exploiting new technology in this field.

After refereeing process, all accepted papers will be published on international journal "Advanced Materials Research" and will be indexed in the major academic databases, including EI Compendex, Thomson ISI (CPCI), Elsevier SCOPUS, Chemical Abstracts (CA), and other indexing services. (See TTP's Conference List). Trans Tech Publications will provide online camera-ready paper submission system to save time and decrease the publishing cycle. The full text is online available via platform www.scientific.net. Selected excellent papers will be published on SCI journals.

FOMCD 2014 will be published in Applied Materials and Research(ISSN:1022-6680), which will be indexed by EI Compendex and ISTP.详情参见:http://academic-conference.org/indexing.htm

FOMCD 2014将被应用材料研究(ISSN:1022-6680)出版,并被EI检索,目前,该期刊2014年EI检索正常。 前两届会议均被EI和ISTP检索。

The submission system is https://www.easychair.org/conferences/?conf=fomcd2014

Themes and Topics
(I) New Materials and Advanced Materials
(II) Manufacturing Processes and Systems
(III) Advanced Design Technology
(IV) Automation and Computer Engineering
(V) Computer Engineering Topics

Contact Us
Email:fomcd2014@163.com
Tel:15927694084 or 02787772193(Office)

Related Resources

ISVLSI 2017   IEEE Computer Society Annual Symposium on VLSI
MSEJ 2017   Advances in Materials Science and Engineering: An International Journal
ICEESM 2017   2017 2nd International Conference on Energy Engineering and Smart Materials (ICEESM 2017)-SCOPUS, Ei Compendex
ICDMM 2017   2nd International Conference on Design, Materials and Manufacturing -Ei Compendex, Scopus
ICMEN 2017   2nd International Conference on Materials Engineering and Nanotechnology -SCOPUS, Ei Compendex
ISLPED 2017   International Symposium on Low Power Electronics and Design
ICFCC 2017   2017 9th International Conference on Future Computer and Communication (ICFCC 2017) - Ei & Scopus
ICMSNT 2017   2017 2nd International Conference on Materials Science and Nanotechnology (ICMSNT 2017)--Ei&Scopus
MEIJ 2017   Mechanical Engineering: An International Journal
ICWOC-SPIE 2017   5th International Conference on Wireless and Optical Communications - SPIE