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IIES 2014 : International Integrated Engineering Summit 2014

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Link: http://iies.uthm.edu.my/
 
When Dec 1, 2014 - Dec 4, 2014
Where Universiti Tun Hussein Onn Malaysia
Abstract Registration Due Jun 1, 2014
Submission Deadline Aug 1, 2014
Notification Due Aug 15, 2014
Final Version Due Aug 15, 2014
Categories    engineering   mechanical & manufacturing   electrical & electronic   civil & environment
 

Call For Papers

IES2014 is the first international summit organized by the integration of three engineering faculties; Faculty of Mechanical and Manufacturing Engineering, Faculty of Civil and Environmental Engineering and Faculty of Electric and Electronic Engineering, combining mostly all disciplines in the faculties in order to gather and attract variety of experts from various backgrounds all around the world.

The summit is divided into 13 technical conferences and 2 product exhibitions:

1. International Forum and Exhibition on Engineering Design (iNFEED)
2. International Conference on Industrial Engineering (ICIE)
3. International Conference on Advances in Mechanics (ICAM)
4. International Conference on Energy and Combustion (ICEC)
5. International Conference on Additive Manufacturing Research (ICAMR)
6. International Conference on Fluid Mechanic and Heat Transfer (FMHT)
7. Tropical Soil International Conference (TSIC)
8. International Conference on Sustainable Construction (ICSC)
9. International Conference on Environment and Green Technology (ICEGT)
10.International Conference on Green Transportation (ICGT)
11.International Conference on Nanoelectronic Engineering (ICNEE)
12.International Conference on Integrated Electrical and Electronic Engineering (ICIEEE)
13.International Research on Engineering Education Symposium (IREES)
14.Regional TechRural
15.Innovators

This summit aims to provide a platform for academics, researchers and industrial players to share knowledge and ideas, widen networking, present their research findings and explore any other potential benefits that might be contribute to the better future. All accepted papers will be published online as OPEN ACCESS in the Applied Mechanics and Materials (indexed by Scopus). ANDROID TABLET containing all conference's information will be given to all participant upon on site registration.

We look forward to welcoming you to Universiti Tun Hussein Onn Malaysia, Batu Pahat Johor Malaysia in December 2014.

FEES

Local Participant :RM 1,180
Local Student :RM 920
International Participant :USD 430
International Student :USD 330
Additional Paper :RM 500 (Local)/USD 200 (Int'l)
TechRural :RM 400 (Local)/USD 150 (Int'l)
Innovators (For Student Only):RM 300

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