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INTERCON 2014 : XXI INTERNATIONAL CONFERENCE ON ELECTRICAL ENG., ELECTRONICS ENG. AND COMPUTER SCIENCE

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Link: http://ucsp.edu.pe/intercon2014/
 
When Aug 4, 2014 - Aug 8, 2014
Where Arequipa - Perú
Submission Deadline Apr 4, 2014
Notification Due May 23, 2014
Final Version Due Jul 11, 2014
Categories    electrical engineering   electronics   telecommunications   computing, software & applicat
 

Call For Papers

INTERCON 2014
XXI INTERNATIONAL CONFERENCE ON ELECTRICAL ENG., ELECTRONICS ENG. AND COMPUTER SCIENCE

Technically co-sponsored by:
IEEE Peru Section


4 - 8 August, 2014
Arequipa, Peru


www.ucsp.edu.pe/intercon2014
intercon2014@ucsp.edu.pe
facebook: /intercon2014


IMPORTANT
------------------------------
All accepted and presented (oral session at INTERCON) papers will be included in the Conference Proceedings, published with ISBN.


Authors are invited to contribute to this conference by submitting papers that illustrate research results, projects, surveys and industrial experiences describing significant advances in the following areas, but not limited to:


1. Electrical Engineering
- Power electronics & energy systems
- Generation, transmission & energy distribution
- Renewable energy & smart grid
2. Electronics
- Industrial control & automation systems
- Microelectronics
- Bioengineering
3. Telecommunications
- Signal processing & multimedia
- Networking
- Telecommunication systems & radiofrequency
4. Computing, software & applications
- Artificial intelligence & machine learning
- Graphical computing
- Information systems & software


* Papers belonging or related to any of the topics mentioned must be submitted in SPANISH, ENGLISH or PORTUGUESE in .pdf format through the JEMS platform (https://submissoes.sbc.org.br/)


IMPORTANT DATES
-------------------------------
April 4, 2014: Deadline for paper submission
May 23, 2014: Notification of acceptance
July 11, 2014: Deadline for camera-ready paper
4 to 8 August 2014: XXI INTERCON


TECHNICAL PROGRAM COMMITTEE
-------------------------------------------------------
GENERAL CHAIR
Fernando Perez Cruz, Ph.D.
Research Scientist, Amazon, USA
Univ. Carlos III de Madrid

CO-CHAIRS
Power electronics & energy systems:
Jose Jardini, Universidad de Sao Paulo, Brasil

Generation, transmission & energy distribution:
Hugh Rudnick, Pontificia Univ. Católica de Chile

Renewable energy & smart grid:
Salvador Acha, National Inst. for Advanced Technology, México

Industrial control & automation systems:
William Ipanaqué, Universidad de Piura, Perú

Microelectronics:
Daniel León Salas, Purdue University, USA

Bioengineering:
Jesús Malo López, Univ. de Valencia, España

Signal processing & multimedia:
Fernando Pérez Cruz, Amazon, USA
Univ. Carlos III de Madrid

Networking:
David Larrabeiti, Univ. Carlos III de Madrid

Telecommunication systems & radiofrequency:
Ana García Armada, Univ. Carlos III de Madrid

Artificial intelligence & machine learning:
Ivan Túpac, Univ. Católica San Pablo, Perú

Graphical computing:
Alex Cuadros, Univ. Católica San Pablo, Perú

Information systems & software:
Javier García Guzmán, Univ. Carlos III de Madrid



ABOUT INTERCON 2014
----------------------------------------
The XXI INTERNATIONAL CONFERENCE ON ELECTRICAL ENG., ELECTRONICS ENG. AND COMPUTER SCIENCE INTERCON 2014 is one of the most important technological events in Peru and Latin-America. This year it will be held in Arequipa, Perú, organized by the IEEE-UCSP Student Branch and the School of Electronics & Telecommunications Engineering, with the direct collaboration of all members of the Technical Program Committee, IEEE Peru Section, and all its partners.



ABOUT AREQUIPA, PERU
----------------------------------------
INTERCON 2014 will take place in Arequipa, located in southern Peru, a.k.a. the "White City" for its colonial buildings made of ashlar; it is famous for its exquisite cuisine. The colonial center of this city was declared in the year 2000 as a Historical Heritage of Humanity, and houses the convent of Santa Catalina (the only one in the world made as a "citadel"). In Arequipa is located the Colca Canyon, the third deepest one in the world, which is only 165 km away from the city. Guarded by three beautiful mountains, this city is adjacent to Cusco, ancient capital of the Inca Empire, home of the famous citadel of Machu Picchu (one of the seven new wonders of the world).


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