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ECM 2014 : 1st International Electronic Conference on Materials

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Link: http://sciforum.net/conference/ecm-1/
 
When May 26, 2014 - Jun 10, 2014
Where Online
Abstract Registration Due Apr 1, 2014
Submission Deadline May 4, 2014
Notification Due Apr 14, 2014
Final Version Due May 4, 2014
Categories    functional materials   interfaces in materials   biomedical engineering   biomedical applications
 

Call For Papers

1st International Electronic Conference on Materials

We are pleased to announce the 1st International Electronic Conference on Materials, chaired by Prof. Dr. Maryam Tabrizian from McGill University in Montreal, Canada.

The conference will comprise of the following sections:

Functional Materials and Interfaces in Food (Section A)
Functional Materials and Interfaces for Sustainable Development (Section B)
Functional Materials and Interfaces for Energy (Section C)
Functional Materials and Interfaces for Biomedical Applications (Section D)

For the 1st International Electronic Conference on Materials (ECM), we invite scholars from all over the world to present their current novel ideas and latest research on fundamental aspects of materials or concerning their application. Late in the 20th century, we witnessed profound changes in the field of materials.

The advent of nanomaterials and new materials processing techniques have provided us with opportunities to push the frontiers of materials sciences and engineering beyond our imagination. This is precisely what we aim to capture and cover during this special event.

We are looking for experts and scholars who would like to share their knowledge, expertise and the most recent progress by joining this conference which is, itself, a novel way of exchanging ideas with our community.

The conference will be completely free of charge—both to attend, and for scholars to upload and present their latest work on the conference platform. There will further be a possibility to submit selected papers to the journal Materials (ISSN 1996-1944; Impact Factor: 2.247 (2012); 5-Year: 2.338 (2012); www.mdpi.com/journal/materials).

ECM offers you the opportunity to participate in this international, scholarly conference without having the concerns and expense of travelling—all you need is your computer and access to the Internet. We would like to invite you to “attend” this conference by presenting your latest work.

Abstracts (in English) should be submitted by 1 April 2014 online at sciforum.net/conference/ecm-1/call.

We hope you will be able to join this exciting event and support us in making it a success. The 1st International Electronic Conference on Materials is organized and sponsored by MDPI, a scholarly open access publisher (http://www.mdpi.com/).

Paper Submission Guidelines

For information about the procedure for submission, peer-review, revision and acceptance of conference proceedings papers, please refer to the section "Instructions for Authors":
sciforum.net/conference/ecm-1/instructions
Time Schedule

Deadline for Abstract Submission: 1 April 2014
Notification of Acceptance: 14 April 2014
Deadline for Submission of Conference Proceedings Papers: 4 May 2014
Conference Open: 26 May to 10 June 2014

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