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ISLPED 2014 : International Symposium on Low Power Electronics and Design

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Conference Series : International Symposium on Low Power Electronics and Design
 
Link: http://www.islped.org/2014/index.html
 
When Aug 11, 2014 - Aug 13, 2014
Where La Jolla, CA
Abstract Registration Due Feb 28, 2014
Submission Deadline Mar 7, 2014
 

Call For Papers

ISLPED 2014 CALL FOR PAPERS
INTERNATIONAL SYMPOSIUM ON LOW POWER ELECTRONICS AND DESIGN
http://www.islped.org
Sponsored by IEEE/ACM
La Jolla, CA, USA
Aug. 11 - Aug. 13, 2014

The International Symposium on Low Power Electronics and Design (ISLPED) is the premier forum for presentation of recent advances in all aspects of low power design and technologies, ranging from process and circuit technologies, simulation and synthesis tools, to system level design and optimization. Specific topics include, but are not limited to, the following two main areas, each with three sub-areas:

1. Technology, Circuits, and Architecture
1.1. Technologies: Emerging Low-power technologies for Device, Interconnect, Logic, Memory, 2.5/3D, Cooling, Harvesting, Sensors, Optical, Printable, Biomedical, Battery, and Alternative energy storage devices.
1.2. Circuits: Low-power digital circuits for Logic, Memory arrays, Reliability, Clocking, Power gating, Resiliency, Near-Threshold Voltage (NTV), Sub-threshold, Variability, and Digital assist schemes; Low-power analog/mixed-signal circuits for Wireless, RF, MEMS, AD/DA Converters, I/O circuits, PLLs/DLLS, Imaging, DC-DC converters, and Analog assist schemes.
1.3. Logic and Architecture: Low-power logic and microarchitectures for SoC designs, Processor cores (compute, graphics and other special purpose cores), Register file, Cache, Memory, Arithmetic/Signal processing, Encryption, Variability, Asynchronous design, and Non-conventional computing.
2. CAD, Systems, and Software
2.1. CAD Tools and Methodologies: CAD tools and methodologies for low-power and thermal-aware design addressing power estimation, optimization, reliability and variation impact on power, and power-down approaches at all design levels: physical, circuit, gate, RTL, behavioral, and algorithmic.
2.2. Systems & Platform: Low-power, power-aware, and thermal-aware system design and platforms for microprocessors, DSP, embedded systems, FPGA, ASIC, SoC, heterogeneous computing, novel systems, data-center power delivery and cooling, and system level power implications due to reliability and variability.
2.3. Software & Applications: Energy-efficient, energy-aware, and thermal-aware software and application design including scheduling and management, reliability and variability optimizations, and emerging low power applications like approximate and brain-inspired computing, low power distributed body-area/in-body networks, and sensor networks.

Submissions on new topics: emerging technologies, architectures/platforms, and applications are particularly encouraged.

TECHNICAL PAPER SUBMISSIONS DEADLINE:
Abstract registration: Feb 28, 2014
Full paper: March 7, 2014

Submissions should be full-length papers of up to 6 pages (double-column, ACM SIG Proceedings format, available at http://www.acm.org/sigs/publications/proceedings-templates), including all illustrations, tables, references and an abstract of no more than 100 words. Papers exceeding the six-page limit will not be reviewed. Submission must be anonymous: papers identifying the authors and/or with explicit references to their prior work will be automatically rejected. Electronic submission in pdf format only via the web is required. More information on electronic submission to ISLPED’14 can be found at http://www.islped.org.

Submitted papers must describe original work that will not be announced or published prior to the Symposium and that is not being considered or under review by another conference at the same time. Accepted papers will be presented in one of two parallel tracks: one focusing on architectures, circuits and technologies, the other on design tools and systems and software design for low power. Notification of paper acceptance will be mailed by April 28, 2014 and the camera-ready version of the paper will be due by June 2, 2014. Accepted papers will be published in the Symposium Proceedings and included in the ACM Digital Library. Authors of a few selected papers from the Symposium will also be given an opportunity to submit enhanced versions of their papers for publication in a special issue of a reputed journal. ISLPED’14 will present two Best Paper Awards based on the ratings of reviewers and an invited panel of judges.

INVITED TALK, PANEL, AND TUTORIAL PROPOSALS DEADLINE:
Received by: March 14, 2014

There will be several invited talks by industry and academic thought leaders on key issues in low power electronics and design. All invited talks will be in plenary sessions. The Symposium may also include embedded tutorials to provide attendees with the necessary background to follow recent research results, as well as panel discussions on future directions and design/technology alternatives in low power electronics and design. Proposals for invited talks, embedded tutorials, and the panel should be sent to the Technical Program Co-Chairs.

EXHIBITION REQUESTS DEADLINE:
Received by: April 28, 2014

People from Industry or Academia interested in exhibiting at ISLPED’14 should contact the symposium General Co-Chairs.

Executive Committee and Symposium Officers

General Co-Chairs:
Yuan Xie
Penn State University

Tanay Karnik
Intel

Program Co-Chairs:
Renu Mehra
Synopsys

Muhammad M. Khellah
Intel

Publicity Co-Chairs:
Deming Chen
UIUC

Baris Taskin
Drexel University

Jose Ayala
UCM Spain

Industry Liaison:
Eren Kursun
IBM

Publication Chair:
Paul Wesling
IEEE

Design Contest Co-Chairs:
Yiran Chen
Univ. of Pittsburgh

Mingoo Seok
Columbia University

Treasurer:
Yu Wang
Tsinghua University

Web Chair:
Theocharis Theocharide
University of Cyprus

Local Arrangement Co-Chairs:
Xiangyu Dong
Qualcomm

John (Jack) Sampson
Penn State University

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