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SPM 2014 : Symposium on Solid and Physical Modeling

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Conference Series : Solid and Physical Modeling
 
Link: http://www.mae.cuhk.edu.hk/~spm2014/
 
When Oct 26, 2014 - Oct 28, 2014
Where Hong Kong, China
Abstract Registration Due Mar 30, 2014
Submission Deadline Apr 8, 2014
Notification Due May 22, 2014
Final Version Due Aug 1, 2014
Categories    computer graphics
 

Call For Papers

Symposium on Solid and Physical Modeling 2014 (SPM 2014) will be held on Oct 26 - 28, 2014, in the Chinese University of Hong Kong, Hong Kong, co-located with the Shape Modeling International 2014 (SMI 2014).

General Information
The focus of this symposium is on the mathematical and computational issues that arise in generating, analyzing, and processing geometric information in applications such as: mechanical design, process planning, manufacturing, medicine, games, animation, geology, and virtual reality.
The symposium is organized with the support of the Solid Modeling Association (SMA). During the symposium, the SMA will award the 2014 Pierre Bézier Prize for contributions to solid, shape and physical modeling.
Proceedings papers should present previously unpublished, original results that are not simultaneously submitted elsewhere. All papers will be rigorously peer-reviewed by members of the international program committee.
The SPM 2014 proceedings, including full papers and short papers, will be published as a journal special issue in Computer-Aided Design (Elsevier). Papers will be available for download during the conference.
The journal status of the proceedings requires a two-stage review process with conditional acceptance after the first round and final acceptance based on the revised submissions. Full and short papers undergo the same review process.

Conference Topics
We invite submissions related, but not limited to the following topics:

• Applied algebraic and differential geometry
• Applied computational geometry and topology
• Conceptual, collaborative, and distributed design
• Curve, surface, and manifold modeling
• Dimensioning and tolerancing
• Feature modeling, recognition, and understanding
• Geometric and topological representations
• Geometric constraint solving and parametric modeling
• Geometry generation, processing, compression, and transmission
• Meshing and mesh optimization
• Multi-resolution and heterogeneous modeling
• Numerical analysis of geometric algorithms
• Physically-based modeling and simulation
• Product and assembly modeling and planning
• Product data exchange, standards, and interoperability
• Reverse engineering and reconstruction of surfaces and solids
• Robustness and validity of geometric computations
• Shape modeling, synthesis, and analysis

Applications:
• Biomedical, biochemical, and geo-scientific applications
• Computer-aided design, manufacturing, and engineering
• Computer graphics, visualization, and animation
• Computer vision and image processing
• Prototyping and manufacturing technologies
• Robotics and automation
• User interfaces, virtual and augmented reality
• Virtual prototyping and model validation

Related Resources

ISSCC 2017   International Solid-State Circuits Conference
ICCVG 2018   International Conference on Computer Vision and Graphics
JARES 2017   International Journal of Advance Robotics & Expert Systems
ICGSP-Ei 2017   2017 International Conference on Graphics and Signal Processing (ICGSP 2017) -- EI &Scopus
SMI 2017   Shape Modeling International Conference
MASCOTS 2017   25th IEEE International Symposium on the Modeling, Analysis, and Simulation of Computer and Telecommunication Systems
IJCGA 2017   International Journal of Computer Graphics & Animation
ER 2017   International Conference on Conceptual Modeling
IJITMC 2017   International Journal of Information Technology, Modeling and Computing
MEDI 2017   7th International Conference on Model and Data Engineering