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DAIS 2014 : 14th IFIP International Conference on Distributed Applications and Interoperable Systems

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Conference Series : Distributed Applications and Interoperable Systems
 
Link: http://dais.discotec.org
 
When Jun 3, 2014 - Jun 6, 2014
Where Berlin, Germany
Abstract Registration Due Feb 1, 2014
Submission Deadline Feb 7, 2014
Notification Due Mar 10, 2014
Final Version Due Mar 24, 2014
 

Call For Papers

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DAIS
14th IFIP International Conference on
Distributed Applications and Interoperable Systems
http://dais.discotec.org
June 3-6, 2014, Berlin, Germany

* Important Dates *

1 February, 2014: Abstract submission
7 February, 2014: Paper submission
10 March, 2014: Notification to authors
24 March, 2014: Camera-ready version due

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* Scope *

The annual IFIP DAIS conference is one of the leading international
venues to discuss all aspects of distributed applications and systems,
throughout their lifecycle. This includes the design, architecture,
implementation and operation of distributed computing systems, their
supporting middleware, appropriate software engineering methods and
tools, as well as experimental studies and practical reports.

Following the success of past conferences in this series, the 14th
International DAIS conference will provide a forum for researchers,
industry practitioners, and users, to discuss and learn about new
technologies, approaches, concepts and experiences in the field of
distributed computing.

Submission tracks: DAIS offers three distinct submission tracks
(Research papers, Practical Experience Reports, and
Work-in-progress papers). Authors should indicate in their submission
which track they are submitting to. All papers accepted in any of
the tracks will be included in the conference proceedings.

* Topics of Interest *

DAIS'14 solicits high-quality papers reporting research results and/or
experimental results in the area of distributed applications and
interoperable systems. Submissions will be judged on their originality,
significance, clarity, relevance, and technical correctness. The
topics of interest to the conference include, but are not limited to:
- Novel and innovative distributed applications and systems, in
particular in the areas of middleware, peer-to-peer systems,
cloud and grid computing, social networking, cyber-physical
systems, mobile computing, service-oriented computing, and
context-aware computing;
- Novel architectures and mechanisms, in particular in the areas of
pub/sub systems, language-based approaches, overlay network
protocols, virtualisation, parallelization, bio-inspired
distributed computing;
- System issues and design goals, including self-management,
trust and reputation, cooperation incentives and fairness,
fault-tolerance and dependability, energy-efficiency,
performance, robustness and scalability;
- Engineering and tools, including model-driven engineering,
domain-specific languages, design patterns and methods, testing
and validation, distributed debugging.

* Submission and Publication *

DAIS'14 offers three submission tracks:
- Full research papers with no more than 14 pages;
- Full practical experience reports, including experimental and
evaluation studies, case studies, and practice reports with no
more than 14 pages;
- Work-in-progress papers, describing ongoing work and interim
results, with no more than 6 pages. All papers must be
original, unpublished, and not submitted for publication
elsewhere.

Contributions should be submitted electronically as PDF using
the Springer LNCS style (http://www.springer.com/computer/lncs)
to the conference submission website:
https://www.easychair.org/conferences/?conf=dais2014

Each paper will undergo a thorough process of peer reviews by the
Program Committee. All papers accepted in any of the conference
tracks will be included in the conference proceedings, which will
be published by Springer-Verlag in the LNCS series. Proceedings
will be made available at the conference. Submission implies that
at least one author will register and attend the conference if the
paper is accepted.

* Invited Speakers *

Frank Leymann (University of Stuttgart, Germany)
Marten van Steen (VU University Amsterdam, Netherlands)
Joachim Parrow (Uppsala University, Sweden)

* Program Committee Co-Chairs *

Kostas Magoutis, ICS-FORTH, Greece
Peter Pietzuch, Imperial College, UK

* Publication Chair *

Eva Kalyvianaki, City University London, UK

* Program Committee *

Stergios Anastasiadis, University of Ioannina, Greece
Cosmin Arad, Google, USA
Danilo Ardagna, Politecnico di Milano, Italy
Carlos Baquero, Universidade do Minho, Portugal
Gordon Blair, Lancaster University, UK
Wolfgang De Meuter, Vrije Universiteit Brussel, Belgium
Jim Dowling, KTH Royal Institute of Technology, Sweden
Frank Eliassen, University of Oslo, Norway
David Eyers, University of Otago, Australia
Paulo Ferreira, INESC ID / Technical University of Lisbon, Portugal
Kurt Geihs, Universitaet Kassel, Germany
Karl Goeschka, Vienna University of Technology, Austria
Franz Hauck, University of Ulm, Germany
Peter Herrmann, NTNU Trondheim, Norway
Eva Kalyvianaki, City University London, UK
Boris Koldehofe, University Of Stuttgart, Germany
Dejan Kostic, Institute IMDEA Networks, Spain
Reinhold Kroeger, Wiesbaden University of Applied Sciences, Germany
Benny Mandler, IBM Research, Israel
Rene Meier, Trinity College Dublin, Ireland
Hein Meling, University of Stavanger, Norway
Pietro Michiardi, Institut Eurecom, France
Alberto Montresor, University of Trento, Italy
Kiran Muniswamy-Reddy, Amazon, USA
Dirk Muthig, Lufthansa Systems, Germany
George Papadopoulos, University of Cyprus, Cyprus
Nikos Parlavantzas, INSA Rennes, France
Jose Pereira, INESC TEC & Univ. Minho, Portugal
Jayaram Radhakrishnan, HP Labs, USA
Etienne Riviere, University of Neuchatel, Switzerland
Giovanni Russello, University of Auckland, Australia
Lionel Seinturier, University Lille 1, France
Liuba Shrira, Brandeis University, USA
Francois Taiani, Université de Rennes 1, France
Luis Veiga, Instituto Superior Técnico - UTL / INESC-ID Lisboa, Portugal
Spyros Voulgaris, VU University Amsterdam, The Netherlands

* Steering Committee *

Jim Dowling, KTH Royal Institute of Technology, Sweden
Frank Eliassen, University of Oslo, Norway
Pascal Felber, Université de Neuchâtel, Switzerland
Karl Goeschka, Vienna University of Technology, Austria
Seif Haridi, KTH, Sweden
Ruediger Kapitza, Technical University of Braunschweig, Germany
Rui Oliveira, Universidade do Minho, Portugal
Romain Rouvoy, University Lille 1, France
Francois Taiani, Université de Rennes 1, France

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