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ICCTS 2014 : 2014 International Conference on Communication Technology and System


When May 9, 2014 - May 10, 2014
Where Shanghai (Kunshan), China
Submission Deadline Feb 15, 2014
Notification Due Mar 15, 2014
Final Version Due Mar 15, 2014
Categories    computer science   communication

Call For Papers


2014 International Conference on Communication Technology and System (ICCTS 2014) will be held on May 9-10, 2014, Shanghai (Kunshan), China.

ICCTS 2014 will be the most comprehensive conference focused on the various aspects of advances in Communication Technology and System. Our conference provides a chance for academic and industry professionals to discuss recent progress in the area of Communication Technology and System.

The goal of this conference is to bring together the researchers from academia and industry as well as practitioners to share ideas, problems and solutions relating to the multifaceted aspects of Communication Technology and System. The complete list of topics are updating. Please check the Call for Papers section.

ICCTS 2014 will be published in WIT Transactions on Information and Communication Technologies (ISSN: 1743- 3517) , which will be indexed by EI Compendex and ISTP.

ICCTS 2014 将被WIT信息与通信技术出版,并被EI检索,目前,该期刊2013年EI检索正常。

The conference calls for research papers reporting original investigation results of research and devel- opment on real embedded system applications and their system development.

A. Embedded system architecture: Multiprocessors, reconfigurable platforms, memory management support, communication, protocols, network-on-chip, real-time systems, embedded microcontrollers.
B. Real-time systems: All real-time related aspects such as software, distributed real-time systems, real-time kernels, real-time OS, task scheduling, multitasking design.
C. Embedded hardware support: System-on-a-chip, DSPs, hardware specification, synthesis, modeling, simulation and analysis at all levels for low power, power-aware, testable, reliable, verifiable systems, performance modeling, validation, security issues, real-time behavior and safety critical systems.
D. Embedded software: Compilers, assemblers and cross assemblers, programming, memory man- agement, object-oriented aspects, virtual machines, scheduling, concurrent software for SoCs, distributed/resource aware OS, OS and middleware support.
E. Hardware/software co-design: Methodologies, test and debug strategies, real-time systems, speci- fication and modeling, design representation, synthesis, partitioning, estimation, design space explo- ration beyond traditional hardware/software boundary and algorithms.
F. Testing techniques: All aspects of testing, including design-for-test, test synthesis, built-in self-test, embedded test, for embedded and system-on-a-chip systems.
G. Application-specific processors and devices: Network processors, real-time processor, media and signal processors, application specific hardware accelerators, reconfigurable processors, low power embedded processors, bio/fluidic processors, Bluetooth, hand-held devices, _ash memory chips.
H. Industrial practices and benchmark suites: System design, processor design, software, tools, case studies, trends, emerging technologies, experience maintaining benchmark suites, representation, interchange format, tools, copyrights, maintenance, metrics.
I. Embedded computing education: Curriculum issues, teaching tools and methods.
J. Emerging new topics: New challenges for next generation embedded computing systems, arising from new technologies (e.g., nanotechnology), new applications (e.g., pervasive or ubiquitous com- puting, embedded internet tools) and new principle (e.g., embedded Engineering).
K. Embedded System Applications: All ranges of applications on embedded system, including speech processing, image processing, network computing, distributed computing, parallel computing and power conversion.
L. Automotive Engineering: Automotive design, new challenges on development of autoparts and automatives, safety engineering, fuel economy/emissions, vehicle dynamics, NVH engineering, auto- motive performance, shift quality, durability/corrosion engineering, package/ergonimics engineering, climate control, derivability, program timing, assembly feasibility, automotive embedded systems.
M. Management Technology: Service science, management and engineering, Operations, Logistics and Supply chain management, Optimization, Probabilistic and Statistical Model, Economics, Occupational safety and health management, Ergonomics, Human Resouce and Organization managemnet, Environmental management.

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