posted by user: 20110407 || 253 views || tracked by 1 users: [display]

ICMAM2013-- 2013 : The last round CFP for 3rd ICMAM2013 in Pairs_ Engineering Indexed & Elsevier. Scopus

FacebookTwitterLinkedInGoogle

Link: http://www.ttp-icmam.org
 
When Dec 27, 2013 - Dec 28, 2013
Where Paris
Submission Deadline Nov 30, 2013
Notification Due Dec 10, 2013
Final Version Due Dec 10, 2013
Categories    mechatronics   applied mechanics   engineering index
 

Call For Papers

2013 the 3rd International Conference on Mechatronics and Applied Mechanics (ICMAM2013)
Dec.27-28,2013 Paris,France http://www.ttp-icmam.org
The last round Call for Paper

The 3rd ICMAM2013 takes the privilege to once again invite you to yet another new edition of the prestigious the famous Engineering Index Journal -“Applied Mechanics and Materials”[ISSN:1660-9336, Trans Tech Publications] “.

All submitted papers are judged based on their quality by the technical 3rd ICMAM2013 committee, peer-review mandate and review panel. Papers that describe research and experimentation are encouraged. Authors can submit their papers via an email to cfp@ttp-icmam.org.

Formatting Your Manuscripts
Prospective authors are kindly invited to submit full text papers including results, tables, figures and references. You must contain all text matter and any figures within one column at least 4 pages and the margins are consistent on all pages. Paper margins must be equal on both sides (2 cm) and 1.5 cm on the top and 2.5 cm bottom. Do not use corner/tick marks.

The 3rd ICMAM2013 has been list on the Trans Tech Publications (TTP) official conference list http://www.scientific.net/conference-923. Important Dates:
Paper Submission Last Date:
Nov. 30,2013
Results Notification: Minimum 10 days from paper submitted date
Registration Date: During Dec. 10,2013
Conference Date: Dec. 27-28.2013
Submission Method
1.Researchers can email original research paper to cfp@ttp-icmam.org
2. Submit paper by Easychair
https://www.easychair.org/conferences/?conf=3rdicmam2013
Scope:
T1: Manufacturing Technology and Processing
T2: Mechatronics and Automation
T3: Mechatronics and Embedded System Applications
T4: Applied Mechanics and Other topics


Related Resources

ISSTA 2024   The ACM SIGSOFT International Symposium on Software Testing and Analysis (Round 1)
IEEE-Ei/Scopus-SGGEA 2024   2024 Asia Conference on Smart Grid, Green Energy and Applications (SGGEA 2024) -EI Compendex
IF8.7-SCI-CFP-CCORE 2024   The 3rd International Conference on Climate Change and Ocean Renewable Energy (CCORE 2024)
CRYPIS 2024   13th International Conference on Cryptography and Information Security
ICSE 2024   The IEEE/ACM International Conference on Software Engineering (Second Round)
CNCIT 2024   2024 3rd International Conference on Networks, Communications and Information Technology (CNCIT 2024)
ISSTA 2024   The ACM SIGSOFT International Symposium on Software Testing and Analysis (Round 2)
RAAI 2024   IEEE--2024 4th International Conference on Robotics, Automation, and Artificial Intelligence (RAAI 2024)
IEEE-Ei/Scopus-ACEPE 2024   2024 IEEE Asia Conference on Advances in Electrical and Power Engineering (ACEPE 2024) -Ei Compendex
MEVE--EI 2024   2024 6th International Conference on Mechanical Engineering and Vehicle Engineering (MEVE 2024)