posted by user: sbosse || 9998 views || tracked by 14 users: [display]

IEEE Sensors MIS 2014 : IEEE Sensors Special Issue Material Integrated Sensing

FacebookTwitterLinkedInGoogle

Link: http://www.ieee-sensors.org/
 
When N/A
Where N/A
Submission Deadline Aug 31, 2013
Categories    sensor networks   signal processing   industrial engineering   robotics
 

Call For Papers

Call for Papers IEEE Sensors Journal Special Issue on Material-Integrated Sensing

!!! Deadline extended to 31/8/2013 !!!

Realizing truly intelligent materials requires endowing them with the capability to gather information about themselves and their environment, complemented by material-integrated data evaluation and ability for internal/external communications. This allows context-dependent response and thus distinguishes this class of materials from e.g. self-healing concepts, in which response is hard-wired. Currently, context-dependent capabilities are realized on a component or structural level. However, in the near- to mid-term future, material integration to a system level will become possible by trends such as component miniaturization.

This Special Issue aims to provide an overview of the current achievements along this top-down approach, towards material-integrated intelligence. It will target review articles reflecting the present state of trend setting research and defining technological fields within their scope. We also invite accompanying research papers detailing the latest developments in the field, as well as case studies describing the application of material-integrated systems.

Topics
• Sensors and electronics for material integration: compliance with process/material, case studies
• Interfacing technologies: interconnects (electrical/optical), packaging and compliance
• Reliable and robust data processing: real-time evaluation, artificial intelligence methods
• Reliable and robust communication: communication protocols and hardware solutions
• Energy supply: energy harvesting, management, distribution and storage
• Application scenarios: structural health monitoring, “fly-by-feel“, vibroacoustic control

Other topics, clearly falling under the title of the Specal Issue, shall be considered for inclusion.

Paper submission

Paper submission must be done online:
http://mc.manuscriptcentral.com/sensors

When submitting, please indicate in the “Manuscript Type” roll-down menu, and also by e-mail to Ms. Alison Larkin (a.larkin@ieee.org), that the paper is intended for the “Material-integrated Sensing” Special Issue.

The guidelines for paper preparation and submission are available here:
http://www.ieee.org/sensors


Guest Editors

• Walter Lang, IMSAS, University of Bremen, GER
• Fu-Kuo Chang, Stanford University, USA
• Paul C.-P. Chao, National Ciao Tung University, TWN
• Stefan Bosse, WG Robotics, University of Bremen, GER
• Dirk Lehmhus, ISIS, University of Bremen, GER

Related Resources

SP 2020   IEEE Symposium on Security and Privacy
IWUAS 2020   2020 International Workshop on Unmanned Aircraft Systems (IWUAS 2020)
IEEE COINS 2020   Internet of Things IoT | Artificial Intelligence | Machine Learning | Big Data | Blockchain | Edge & Cloud Computing | Security | Embedded Systems | Circuit and Systems | WSN | 5G
EI-JCRAI 2019   2019 2nd International Joint Conference on Robotics and Artificial Intelligence(JCRAI 2019)
CIPSBSN 2020   Special Issue Computational Intelligence for Physiological Sensors and Body Sensor Network
EI--JCICE 2020   2020 International Joint Conference on Information and Communication Engineering(JCICE 2020)
Special Issue MDPI Applied Sciences 2019   Special Issue on Intelligent Health Services Based on Biomedical Smart Sensors
EI--ICVISP 2020   2020 4th International Conference on Vision, Image and Signal Processing (ICVISP 2020)
IEEE ICSGSC--EI, Scopus 2020   2020 The 4th. IEEE International Conference on Smart Grid and Smart Cities (ICSGSC 2020)--EI Compendex, Scopus
EI-CMSME 2020   2020 3rd International Joint Conference on Materials Science and Mechanical Engineering (CMSME 2020)