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MII 2013 : 2013 International Conference on Mechanical Engineering, Industrial Materials and Industrial Electronics (MII 2013)


When Sep 1, 2013 - Sep 2, 2013
Where Hong Kong
Abstract Registration Due Jul 1, 2013
Submission Deadline Jul 15, 2013
Notification Due Jul 18, 2013
Final Version Due Jul 30, 2013
Categories    mechanical engineering   industrial materials   industrial electronics

Call For Papers

Date:September 1-2, 2013 Place: Hong Kong
Book:"Applied Mechanics and Materials" Sponsors: TTP& IERI
Main topics:New Materials and Advanced Materials, Mechanical Engineering and Industrial Electronics Tel:+86 13638690309 or 027-87772193

2013 International Conference on Mechanical Engineering, Industrial Materials and Industrial Electronics (MII 2013) will be held on September 1-2, 2013, Hong Kong.All accepted papers will be published on international journal"Applied Mechanics and Materials" and will be sent for index in the major academic databases, including EICompendex, Thomson ISI (ISTP) and other indexing services. We look forward to meeting you in Hong Kong.


Tel:+86 13638690309 or 027-87772193


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