posted by system || 2498 views || tracked by 2 users: [display]

EDAPS 2008 : Electrical Design of Advanced Packaging and Systems Symposium

FacebookTwitterLinkedInGoogle

Link: http://www.edaps2008.org/Contents/Callforpaper.asp%20globalmenu=5&localmenu=1
 
When Dec 10, 2008 - Dec 12, 2008
Where Seoul, South Korea
Submission Deadline Jul 31, 2008
Categories    manufacturing
 

Call For Papers

[Empty]

Related Resources

EECR 2026   IEEE--2026 12th International Conference on Electrical Engineering, Control and Robotics (EECR 2026)
EI/Scopus-CCCE 2025   2025 2nd International Conference on Cloud Computing and Communication Engineering-EI/Scopus
IEEE-AEEGE 2025   2025 4th International Conference on Advanced Electronics, Electrical and Green Energy (AEEGE 2025)
IEEE ACIRS 2025   IEEE--2025 10th Asia-Pacific Conference on Intelligent Robot Systems (ACIRS 2025)
Integrating Embodied Intelligence and Io 2025   Intelligent Computing: Special Issue: Advanced Intelligent Computation for Integrating Embodied Intelligence and IoT Systems
EI/Scopus-ICBIT 2025   2025 2nd International Conference on Biomedicine and Intelligent Technology-EI/Scopus
IEEE-ADMIT 2025   2025 IEEE 4th International Conference on Algorithms, Data Mining, and Information Technology (ADMIT 2025)
EI/Scopus-ICPEET 2025   2025 4th International Conference on Power Electronics and Electrical Technology-EI/Scopus
AIEDCD 2025   2025 International Conference on AI - Enabled Digital Creative Design
EI/Scopus-ICSSD 2025   2025 International Conference on Smart Manufacturing, Structural Health Monitoring and Digital Twin-EI/Scopus