[SDCS-2013, Barcelona-SPAIN] Call For Papers

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SDCS-2013, Semiconductor Devices, Circuits and Systems
12-14 September, 2013, Barcelona-SPAIN
http://conf-scoop.org/SDCS
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Dear Researcher,

We are cordially inviting you to submit papers to and attend the SDCS-2013,
Semiconductor Devices, Circuits and Systems international workshop: http://conf-scoop.org/SDCS

The workshop to be held in Barcelona/SPAIN, on 12-14 September, 2013.
The purpose of the workshop is to provide a public forum for researchers
from academia, defence, government and industry to present, exchange ideas and
discuss developments in Semiconductor Devices, Circuits and Systems

Topics include, but are not limited to, the following:

• 3D Integration technology
• 3D-IC designs
• Advance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.)
• Advanced gate stack science and technology
• Advanced Interconnect technology
• Advanced lithography technology and unconventional lithography
• Advanced packaging technology
• Advanced process technology
• Analog & RF & Mixed Signal
• Bio Electronics Innovations
• Bio sensors, Imagers, thermoelectric, energy harvesting
• Bioinspired Systems
• Biomedical Circuits and Systems
• Built-In Self Test and Calibration
• Circuit & System Design
• Circuits and Systems for Communications
• Compound semiconductor devices and circuits
• Conventional and Novel device concepts in CMOS, SiGe bipolar, and BiCMOS IC technologies
• Defect and Fault Tolerance Techniques
• Design verification and simulation
• Design, specification and modeling languages and applications
• Device and interconnect reliability
• Digital, Analog, Mixed Signal IC and SOC design technology
• Displays, sensors and MEMS
• DRAM, SRAM and advanced non-volatile memory technologies
• Electronic Design Automation methodologies
• Embedded Design & SoC
• Embedded Memory
• Embedded systems design and industrial applications
• Emulation and prototyping techniques
• Hardware-software co-design and co-verification
• Harvesting / Scavenging Energy circuits
• HP/HV IC designs
• HW-SW Codesign
• IC Packaging Technology
• Integrated Circuit and system design
• Integrated sensors & actuators
• Integration of non-traditional functions on silicon IC platform
• Interconnect, Low K, High K and other process technologies
• Interconnection and packaging technologies
• Low-power, RF devices & circuits
• Micro-Electro-Mechanical system (MEMS)
• MEMS and mensors
• Merged logic and memory
• Modeling and simulation
• More Moore and Beyond Moore devices technologies and architectures
• Nanoelectronic circuits and nanoarchitectures
• Nano-electronics/fabrication/structures
• New memory technologies, RRAMs, CBRAMs, MRAMs, 1T DRAM
• Nonlinear Circuits and systems
• Optical Devices and photonics
• Organic and flexible electronics
• Organic semiconductor devices and technologies
• Packaging and testing technology
• PCB and PWB Technology & Manufacturing
• Power and Energy Circuits and systems
• Programmable devices
• Reconfigurable architectures and novel applications of FPGAs
• RF devices and technologies
• Semiconductor & Nano Technology
• Semiconductor materials and material characterization
• Silicon integrated circuits and manufacturing
• Spintronics based devices
• System-on-Chip (SOC)
• Testing technology
• VLSI Systems & Applications

Important Dates

Full Paper Submission Due July 5, 2013
Acceptance Notification Due July 15, 2013
Camera Ready Paper Due July 25, 2013

For more information about the workshop, organizing committee, submission
instructions, and venue please see the workshop website:
http://conf-scoop.org/SDCS

We look forward to your paper submission and participation at the workshop.

Best Regards
Workshop Secretary
secretary@conf-scoop.org
Scientific Cooperations