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TEI 2014 : Eighth International Conference on Tangible, Embedded and Embodied Interaction

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Conference Series : Tangible and Embedded Interaction
 
Link: http://www.tei-conf.org/14/
 
When Feb 16, 2014 - Feb 19, 2014
Where Munich, Germany
Submission Deadline Aug 1, 2013
Notification Due Oct 21, 2013
Final Version Due Nov 22, 2013
Categories    HCI
 

Call For Papers

All accepted submissions in this category will be included in the conference proceedings and published through the ACM Digital Library. Authors are invited to submit high-quality original work to advance the field. Appropriate topics include but are not limited to:

Case studies and evaluations of working deployments
Analysis of key challenges, proposals of research agenda
Relation of tangible embodied and embedded interaction to other paradigms
Programming paradigms and tools, toolkits, software architectures
Novel interactive uses of sensors+actuators, electronics+mechatronics
Design guidelines, methods, and processes
Novel application areas, innovative solutions/systems and industrial applications
Theoretical foundations, frameworks, and concepts
Philosophical, ethical & social implications
Interfaces specific in form and context to particular cultures
Usability and enjoyment
Advantages, weakness, affordances of tangible, embedded and embodied interaction
Learning from the role of physicality in everyday environments
Tangible interfaces for children and learning
Embodied interaction, movement, and choreography of interaction
Role of physicality for human perception, cognition and experience
Teaching experiences, lessons learned, and best practices
Standardization, production, and business applications
Tangible interaction for artistic, expressive and musical systems
Tabletop, surface, and multi-touch interaction

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