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ICSSM 2013 : 2013 First International Conference on Solid State and Materials (ICSSM 2013)

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Link: http://www.icssm-conf.org/
 
When Jan 30, 2013 - Jan 31, 2013
Where Los Angeles, CA, USA
Submission Deadline Dec 10, 2012
Notification Due Dec 25, 2012
Final Version Due Dec 30, 2012
Categories    solid state science and engine   materials science and engineer   manufacturing engineering   circuits and systems
 

Call For Papers

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2013 First International Conference on Solid State and Materials (ICSSM 2013)
Website: http://www.icssm-conf.org
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2012 International Conference on Solid State and Materials will be held on January 30-31, 2013 at Los Angeles, CA, USA.

The goal of this conference is to bring together the researchers from academia and industry as well as practitioners to share ideas, problems and solutions relating to the multifaceted aspects of Solid State and Materials.

All ICSSM 2013 Papers will be published by Solid State Phenomena (ISSN: 1012-0394), which will be indexed by Indexed by Elsevier: SCOPUS www.scopus.com and Ei Compendex (CPX) www.ei.org/. Cambridge Scientific Abstracts (CSA) www.csa.com, Chemical Abstracts (CA) www.cas.org, Google and Google Scholar google.com, ISI (ISTP, CPCI, Web of Science) www.isinet.com, Institution of Electrical Engineers (IEE) www.iee.org, etc.

The submission system is https://www.easychair.org/conferences/?conf=icssm2013

Paper Submission Due:December 10, 2012

Contact Email: icssm2013@163.com

Tel: + (86) 18672757885 or 18672366652



[12月10日截稿 香港] 2013年固态与材料国际学术研讨会(EI&ISTP)
投稿范围:固态工程、材料科学、机械工程、制造技术、信息工程及其相关学科领域。
大会接收的文章由Solid State Phenomena (ISSN: 1012-0394)出版,并将被EI和ISTP检索。不参会作者,注册费优惠至2200元。
本次会议将挑选约50篇优秀论文直接发表在其他EI/SCI期刊,具体事项另行通知。
会议网站:http://www.icssm-conf.org
咨询电话:18672757885 or 18672366652
联系邮件:icssm2013@163.com
稿件可在投稿系统或联系邮箱icssm2013@163.com提交,任选一种方式即可。

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