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ECEC 2013 : 20th Annual European Concurrent Engineering Conference

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Link: http://www.eurosis.org/cms/?q=node/2280
 
When Apr 15, 2013 - Apr 17, 2013
Where University of Lincoln
Submission Deadline Dec 15, 2012
Notification Due Feb 5, 2013
Final Version Due Mar 20, 2013
Categories    concurrent engineering   lean manufacturing   simulation   modelling
 

Call For Papers

FIRST CALL FOR PAPERS

ECEC'2013
20th Annual European Concurrent Engineering Conference 2013
University of Lincoln
http://www.lincoln.ac.uk/home
LIncoln, United Kingdom
April 15-17, 2013
in conjunction with the annual
EUROMEDIA
http://www.eurosis.org/cms/?q=node/2281
FUBUTEC
http://www.eurosis.org/cms/?q=node/2282
conferences

THEMES:
e-Business in CE
Organization and Management
Supporting Technologies
Formal Methods, Techniques and Design
Engineering of Embedded Systems
Engineering data management and information modeling
Engineering process management and simulation
Collaborative CE environments for virtual teams
CE Enhanced Lean Manufacturing
Practical applications and experiences
Factory Planning and Control for SME's
Data-Driven Tradespace Exploration and Analysis
Digital Direct Manufacturing
Patient Centered Health Care with Meaningful Use of IT
Poster Session
Student Session
Tutorials
Exhibition

Organised by
The European Technology Institute
and Sponsored by
EUROSIS
The University of Lincoln
For latest information see:
www.eurosis.org
or
http://www.eurosis.org/cms/?q=taxonomy/term/331

AIM OF ECEC'2013

The conference aim of the 20th annual European Concurrent Engineering Conference, ECEC'2013 is to provide European Researchers with a forum, where they can discuss the latest developments linked to concurrent engineering focused on European research projects. ECEC'2013 aims to identify the progress that has been made in Concurrent Engineering/Lean Manufacturing over the last year. A special focus of the ECEC'2013 will be the influence of Digital Direct Manufacturing, also known as additive manufacturing , the new field of Data-Driven Tradespace Exploration and Analysis and the new directions in Lean Manufacturing

The ECEC helps the dissemination of information and exploitation of results from the research and technical development and provides a forum for the exchange of experiences in developing and implementing CE based solutions across the wide spectrum of manufacturing and engineering industries. The conference is targeted at industrial enterprises, industrial associations, universities and research institutes.

All submissions will be peer reviewed by at least three members of the International Program Committee. Accepted papers will be published in the conference Proceedings (both print and electronic format), that will be copyrighted and widely disseminated. All talks and tutorials, must be accompanied by a paper of between three to eight Proceedings pages.

The 20th Annual European Concurrent Engineering Conference 2013 is structured around the following ten major topics and three workshops (see workshops page): (To submit a paper click on the links below or use the online form)

1 E-Business in CE

1.1 Organizational influences of e-business
1.2 B2B business models for inter-organizational CE
1.3 Migration to e-business based CE
1.4 E-business applications for CE
1.5 B2B portals for CE
1.6 Emerging standards (e.g. XML, UML)
1.7 E-Procurement, E-Supply, E-Engineering, ....

2 Organisation and management

2.1 Principles of CE
2.2 Multi-disciplined team-working and project team organisation
2.3 Global lean product development and international collaboration
2.4 Life-cycle cost and quality
2.5 Business process re-engineering and outsourcing
2.6 Supply chain management
2.7 Measurement of profitability by the introduction of CE

3 Supporting technologies

3.1 Digital mock-up
3.2 Virtual prototyping
3.3 Rapid prototyping
3.4 Synthetic environments and simulation on the factory floor
3.5 Reverse engineering
3.6 Assembly and disassembly
3.7 High precision manufacturing
3.8 Intelligent Manufacturing
3.8 Sensor and robot assisted machining

4.Formal Methods, Techniques and Design

4.1 Quality Function Deployment
4.2 Total Quality Management
4.3 Global Optimization Techniques and Hybrid Approaches
4.4 Lean design, Value Driven Design, Knowledge Driven Design

5.Engineering of Embedded Systems

5.1 HW/SW C-Design
5.2 System Development Process
5.3 Specification Languages

6 Engineering data management and information modeling

6.1 Integration of geometrical data and product definition
6.2 Product data interchange (PDI) and standards
6.3 Data handling, distribution and transformation
6.4 Data version control and management
6.5 Corporate technical memory
6.6 Design rationale and intent
6.7 Concurrent Design Model CDF-IDM
6.8 Open Concurrent Design Server

7 Engineering Process Management and Modelling

7.1 Process planning in continuous, discrete and hybrid processes
7.2 Process modeling, monitoring and control
7.3 Diagnostics and maintenance
7.4 Automated inspection and quality control
7.5 Production planning, scheduling and control
7.6 CE metrics
7.7 CE process planning, scheduling and simulation
7.8 Workflow-management in CE
7.9 Project and team coordination

8 Collaborative CE environments for virtual teams

8.1 Cooperative problem solving
8.2 CSCW methods and tools
8.3 Information and application sharing
8.4 Computer-based video and audio conferencing and consulting using Smart Boards
8.5 Conflict resolution techniques
8.6 Constraint management
8.7 Negotiation, blackboard and agent-based architecture
8.8 CE-based environments and integrated frameworks
8.9 Architectures for building CE systems
8.10 CE languages and tools
8.11 Distributed computing environments
8.12 WWW based CE systems
8.13 Mobile CE systems
8.14 Networking and Distribution in CE
8.15 Set Based Concurrent Engineering

9 CE Enhanced Lean Manufacturing

9.1 Work Standardization
9.2 5S Workplace Organization
9.3 Visual Controls
9.4 Batch Size Reduction
9.5 Points of Use Storage
9.6 Quality at the Source
9.7 Workflow Practice
9.8 Improved Information and Product Flow
9.9 Cellular Manufacturing
9.10 Pull & Synchronous Scheduling
9.11 Six Sigma & Total Quality
9.12 Rapid Setup
9.13 Work Teams for Cell Management & Process Improvement
9.14 Simplified scheduling and Kanban inventory management (the Toyota Model)
9.15 Lean PD Assessment Tools

10 Practical applications and experiences

10.1 Practical solutions
10.2 Systematic guide-lines
10.3 Pitfalls and success stories
10.4 Case studies, pilot projects and experiments in aerospace, shipbuilding etc..
10.5 Crowdsourcing CE Projects such as FANG

Workshops

The conference organization is open to suggestions on possible workshops featuring software packages, new hardware or methods used in concurrent engineering.

If you want to propose a concurrent engineering simulation workshop please contact; philippe.geril@eurosis.org
Factory Planning and Control for Small and Medium sized Enterprises (SME’s)

The objective of this special session is to provide a forum of discussion of new ideas, methods and tools used in Production Planning and Control (PPC) in for Small and Medium sized Enterprises (SME’s). In this way, the knowledge and experience in new methods and approaches can be shared amongst participants.

The characteristics of SMEs present particular challenges to the implementation of PPC concepts. SMEs often produce a wide variety of products in low volumes in a Make-To-Order (MTO) or Engineering-To-Order (ETO) basis, with limited financial resources and where the adoption of robotics technology has been complex to install, up to now.

Papers addressing the above issues can be submitted in the following main themes:

• Concurrent manufacturing control
• Modelling and simulation of SME’S
• Control of machines, robots and factories for manufacturing
• Man-Machine interaction in a Cognitive factory scenario
• Reconfigurable and agile factory planning
• Implementation of Planning and Control systems in SME’s
• Pull-push systems and mechanisms for manufacturing and materials flow control in SME’s
• Logistics, material-flow and supply chain
• Quality control and management in SME’s
• Agile reconfiguration of manufacturing systems

To submit a paper on this topic use the online form or this link philippe.geril@eurosis.org
Data-Driven Tradespace Exploration and Analysis

Data Driven Tradespace Exploration and Analysis is a new methodology aimed at transforming the conventional engineering process, which is unable to account for today's challenges of increasing system complexity, increasing pace of technology development, uncertain political futures, and the global availability of technology to potential competitors.
The methodology aims to link the following key technical thrusts:
- Systems representation and Modelling (physical, logical structure, behaviour, interactions and interoperability)
- Characterizing Changing Operational Tasks (Deep understanding of technical needs, impacts of alternative designs)
- Cross Domain Coupling (Model Interchange and Composition across scales, disciplines)
- Data-Driven Tradespace Exploration and Analysis (Multidimensional Generation, evaluation of alternative Designs)
- Collaborative Design and Decision Support (Enabling well-informed, low overhead discussion, analysis and assessment among engineers and decision makers)
thus resulting in improved engineering and design capabilities or so-called Engineered Resilient Systems (ERS)

To submit a paper on this topic use the online form or this link philippe.geril@eurosis.org
Direct Digital Manufacturing

There are presently about 25 3D printing technologies. The oldest is layered object manufacturing, followed by stereolithography. More recent technologies include selective laser sintering, Direct Metal Laser Sintering (DMLS), inkjet technologies, fused deposition modeling, Polyjet matrix and many variations.

All of these technologies take a 3D model, compute cross-sections of that model, and then deposit the cross-sections sequentially on top of each other until the final geometry is achieved.

Applications using this technology include direct parts for a variety of industries including Aerospace, Dental, Medical and other industries that have small to medium size, highly complex parts and the Tooling industry to make direct tooling inserts.

As this methodology and technique is used more and more frequently in the manufacturing process we therefore solicit papers for ECEC'2013 in:

* 3D printing
* Additive manufacturing
* Desktop manufacturing
* Digital fabricator
* Direct metal laser sintering
* Fused deposition modeling
* Instant manufacturing, also known as "direct manufacturing" or "on-demand manufacturing"
* Rapid manufacturing
* Rapid prototyping
* Selective laser sintering
* Solid freeform fabrication

To submit a paper on this topic use the online form or this link philippe.geril@eurosis.org
Patient Centered Health Care with Meaningful Use of IT

Internationally, poor quality and safety in medical care are major problems having significant economic and societal, as well as health impacts that require urgent attention. Information Technology(IT) is increasingly recognized as an important part of the solution. The concept of Meaningful Use has been introduced to encourage the medical community to fully explore the potential of IT to transform health care, incorporating decision support, electronic information exchange and interoperability. However, the field is still in its infancy and optimal methods of incorporating IT into complex health care systems have not been established. A particular challenge is the need to keep the patient at the center. The medical establishment has begun to recognise the importance of lessons learned and approaches developed in the field of engineering. This track provides an opportunity for cross-fertilization of ideas and approaches to help accelerate progress in this important domain.

To submit a paper on this topic use the online form or this link philippe.geril@eurosis.org

TUTORIALS

Tutorials can be proposed in the following three categories:
T1- Introductory tutorials
T2- State of the Art Tutorials
T3- Software and Modelware Tutorials
Tutorial proposals should be emailed to Philippe.Geril@eurosis.org before SEPTEMBER 30TH.

A first tutorial has already been proposed:
An Introduction to Software Optimisation using GPU
Greg Cielniak

POSTER SESSION

The poster session only features work in progress. Next to the actual poster presentation, these submissions also feature as short papers in the Proceedings.

STUDENTS SESSION

This session is for students who want to present their work in
progress or part of their doctoral thesis as a paper. Student papers
are denoted by the fact that only the name of the student appears on
the paper as an author. They are published as short papers in the
Proceedings.

DIVERSE ACTIVITIES

For demonstrations or video sessions, please contact EUROSIS.
Special session will be set up for vendor presentations in co-
ordination with the scientific program. User Group meetings for
simulation languages and tools can be organised the day before the
conference. If you would like to arrange a meeting, please contact
the Conference Chairs. We will be happy to provide a meeting room
and other necessary equipment.
Partners for projects session(s) will be organised by EUROSIS to
give potential project teams or individuals the opportunity to
present their research in order to link up with fellow researchers
for future research projects. Those wishing to participate in this
session need to send a proposal to EUROSIS.
A EUROSIS TC Meeting and an EU Project update meeting

EXHIBITION

A special exhibition is envisaged during the conference focused on
industrial applications. For more information please contact EUROSIS for
further details. Email: Philippe.Geril@eurosis.org

DEADLINES AND REQUIREMENTS

Send all submissions in an ELECTRONIC FORM ONLY in (zipped)
Microsoft Word format, or PDF format (PREFERRED FORMAT)indicating the
designated track and type of submission (full paper or an extended
abstract) to the EUROSIS (Philippe.Geril@eurosis.org).
Please provide your name, affiliation, full mailing address,
telephone / fax number and Email address on all submissions as well.
For submissions please put in the subject of your Email the
following indications: ECEC'2013 and designated track or USE THE
ONLINE SUBMISSION FORM.
http://www.eurosis.org/cms/index.php?q=node/2295

Only original papers, which have not been published elsewhere, will
be accepted for publication
Journal Publication

Only accepted and presented extended papers are eligible for journal publication in any of the journals listed here.
Quality Control

In order to ensure the quality of the proceedings, Thomson-Reuters ISI and IET will receive the listing of the actually presented papers, next to the copies of the Proceedings.

All EUROSIS Proceedings are ISI-Thomson Reuters and IET referenced.

REGISTRATION FEES
As the VAT rules for conferences in the UK are set to change only on December 1st 2013 the fees for this conference are as yet VAT free.
Registration Fees
Author

EUROSIS members

Other Participants
Pre-registration before March 20, 2013 EUR 500 EUR 500 EUR 555
Registration after March 20, 2013 Pre-registration required EUR 545 EUR 595
STUDENTS

Students who are authors, pay a registration of EUR 370 . To qualify as a student author you need to send in together with your paper a copy of your student card. Student papers are only accepted as student papers if only the name of the student appears as author of the paper or in the case of multiple authors, all authors should be students.
Registration Fees Students
Author

EUROSIS members

Other Participants
Pre-registration before March 20, 2013 € 370 € 370 € 410
Registration after March 20, 2013 Pre-registration required € 390 € 430

The full registration fee includes one copy of the Conference
Proceedings, coffee and tea during the breaks, all lunches, a
welcome cocktail and a conference dinner.

SOCIAL PROGRAMME
A visit to a related facility in (or near) Lincoln. More information to follow.
The conference dinner will be at the Bishop's Palace in Lincoln - this is a charming location situated in the medieval cathedral complex.
http://www.english-heritage.org.uk/daysout/properties/lincoln-medieval-bishops-palace/

PAPER SUBMISSION TYPES
FULL PAPER (including abstract, conclusions, diagrams, references)
During review, the submitted full papers can be accepted as a
regular 5 page paper. If excellent, full papers can be accepted by
the program committee as an extended (8-page) paper. Each submission
will be reviewed by at least three members of the ECEC'2013
International Program Committee.

EXTENDED ABSTRACT (at least five pages)
Participants may also submit a 5 page extended abstract for a
regular (5 pages) or short (3 pages) paper or poster, which will be
reviewed by the International Program Committee. All accepted papers
will be published in the ECEC'2013 Conference Proceedings.

SHORT ABSTRACT (at least three to four pages)
Participants may also submit a 3 page abstract for a short paper or
poster, which will be reviewed by the International Program
Committee. All accepted papers will be published in the ECEC'2013
Conference Proceedings.

PLEASE NOTE: ONE (1) PAGE ABSTRACTS ARE NOT ACCEPTED.

CORRESPONDENCE ADDRESS
Philippe Geril
EUROSIS-ETI
European Simulation Office
Greenbridge Science Park
Ghent University - Ostend Campus
Wetenschapspark 1
Plassendale 1
B-8400 Ostend Belgium
Tel: +32.59.255330
Fax: +32.59.255339
Email: philippe.geril@eurosis.org

OUTSTANDING PAPER AWARD

The 2013 ECEC Conference Committee will select the Outstanding Paper of the Conference. The author of this paper will be awarded the "Steffen Schwarz" Award, a free registration for a EUROSIS conference. Only papers SUBMITTED AS FULL papers and accepted as EXTENDED papers will be eligible for the Outstanding Paper Award.

LANGUAGE

The official conference language for all papers and presentations is
English

CONFERENCE VENUE

The conference will be held at the University of Lincoln
http://www.lincoln.ac.uk
in the historic medieval city of Lincoln, UK
http://en.wikipedia.org/wiki/Lincoln,_England

IMPORTANT DEADLINES

EARLY BIRD SUBMISSION DEADLINE: NOVEMBER 15TH, 2012
SUBMISSION DEADLINE: DECEMBER 15TH, 2012
LATE SUBMISSION DEADLINE: JANUARY 15TH, 2013
NOTIFICATION OF ACCEPTANCE OR REJECTION: FEBRUARY 5TH, 2013
Authors provide camera-ready manuscript: MARCH 20TH, 2013
CONFERENCE AT THE UNIVERSITY OF LINCOLN: APRIL 15-17, 2013

REPLY CARD
First Name:
Surname:
Occupation and/or Title:
Affiliation:
Mailing Address
Zip code: City: Country.
Telephone: Fax:
E-Mail:
Yes, I intend to attend the ECEC'2013:
[ ] Presenting a paper, by submitting a full paper
[ ] Presenting a short paper (by submitting an extended abstract)
[ ] Participating in the industrial program
[ ] Organizing a vendor session
[ ] Proposing a panel discussion (please mention names of
panellists)
[ ] Contributing to the exhibition
[ ] Without presenting a paper
The provisional title of my paper / exhibited tool is:
With the following highlights:
The paper belongs to the category (please tick only one):
[ ] e-Business in CE
[ ] Organization and Management
[ ] Supporting Technologies
[ ] Formal Methods, Techniques and Design
[ ] Engineering of Embedded Systems
[ ] Engineering data management and information modeling
[ ] Engineering process management and simulation
[ ] Collaborative CE environments for virtual teams
[ ] CE Enhanced Lean Manufacturing
[ ] Practical applications and experiences
[ ] Factory Planning and Control for SME's
[ ] Data-Driven Tradespace Exploration and Analysis
[ ] Digital Direct Manufacturing
[ ] Patient Centered Health Care with Meaningful Use of IT
[ ] Poster Session
[ ] Student Session
[ ] Tutorials
[ ] Exhibition
Other colleague(s) interested in the topics of the conference
is/are:
Name:
Address:
Name:
Address:

Please send or fax this card immediately to:
Philippe Geril, EUROSIS-ETI
Greenbridge Science Park
Ghent University - Ostend Campus
Wetenschapspark 1
Plassendale 1
B-8400 Ostend Belgium
Tel: +32.59.255330
Fax: +32.59.255339

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