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ISQED 2013 : 14th International Symposium on Quality Electronic Design

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Conference Series : International Symposium on Quality Electronic Design
 
Link: http://www.ISQED.org
 
When Mar 4, 2013 - Mar 6, 2013
Where Santa Clara, CA
Submission Deadline Sep 12, 2012
Notification Due Nov 24, 2012
Final Version Due Jan 10, 2013
Categories    ic design, analog, digital   mixed signal, rfic, fpga,   system design, ip design   packaging design, 3d packaging
 

Call For Papers

Call for Papers, Keynote and Tutorial Speakers, Sponsors and Exhibitors - ISQED 2013


14th International Symposium & Exhibits on
QUALITY ELECTRONIC DESIGN - ISQED 2013

March 4-6, 2013. Santa Clara, CA, USA

http://www.isqed.org


Paper Submission Deadline: Sept. 12, 2012
Acceptance Notifications: November 24, 2012
Final Camera-Ready paper: January 10, 2013

ISQED accepts and promotes papers in following areas:

o System-level Design, Methodologies & Tools
o FPGA Architecture, Design, and CAD
o Design of Embedded Systems
o Advanced 3D ICs & 3D Packaging, and Co-Design
o Robust & Power-conscious Circuits & Systems
o Emerging/Innovative Device Technologies and Design Issues
o Design of Reliable Circuits and Systems
o IP Design, quality, interoperability and reuse
o Design Verification and Design for Testability
o Physical Design, Methodologies & Tools
o EDA Methodologies, Tools, Flows
o Design for Manufacturability/Yield & Quality
o Effects of Technology on IC Design, Performance, Reliability,
and Yield


Submission of Papers:
=====================
Papers are published in ISQED proceedings and IEEE Xplore.
For more informationPlease visit:
http://isqed.org/English/Conference/Call_for_Papers.html

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