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ETS 2013 : IEEE European Test Symposium

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Conference Series : European Test Symposium
 
Link: http://www.lirmm.fr/ETS13
 
When May 27, 2013 - May 30, 2013
Where Avignon, France
Submission Deadline Dec 3, 2012
Notification Due Feb 20, 2013
Final Version Due Apr 1, 2013
Categories    test
 

Call For Papers

The areas of interest include (but are not limited to) the following topics.

•Analog Test
•ATE Hardware and Software
•Automatic Test Generation
•Board Test and Diagnosis
•Boundary Scan Test
•Built-In Self Test (BIST)
•Current-Based Test
•Defect-Based Test
•Delay and Performance Test
•Dependability
•Design for Test(ability) – DfT
•Design Verification and Validation
•Diagnosis and Debug
•Economics of Test
•Failure Analysis
•Fault Modeling and Simulation
•Fault Tolerance
•High-Speed I/0 Test
•Low-Power IC Test
•Memory Test and Repair
•MEMS Test
•Microprocessor Test
•Mixed-Signal Test
•Nanotechnology Test
•On-line Test
•Power Issues in Test
•Reliability
•RF Test
•Self-Repair
•Signal Integrity Test
•Stacked IC Test
•Standards in Test
•System Test
•System-in-Package (SiP) Test
•System-on-Chip (SoC) Test
•Soft Errors
•Test(ability) Synthesis
•Test of Reconfigurable Systems
•Test Quality
•Thermal Issues in Test
•Transient and Soft Errors
•Yield Analysis and Enhancement

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