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AMEE 2013 : 2013 2nd International Conference on Applied Materials and Electronics Engineering


When Apr 20, 2013 - Apr 21, 2013
Where Hong Kong
Submission Deadline Nov 25, 2012
Notification Due Dec 10, 2012
Categories    material science   building materials   nanoscience and nanotechnology   electrical engineering

Call For Papers

Call for Papers
The 2013 2nd International Conference on Applied Materials and Electronics Engineering

(AMEE 2013)

Submission Due: Before November 1, 2012

第一届AMEE 2012 已出版在Advanced Materials Research并且已经被EI检索,详细访问(EI Detail) 。本届会议仍由 Advanced Materials Research出版,并提交EI检索。

The 2013 2nd International Conference on Applied Materials and Electronics Engineering (AMEE 2013) will be held from April 20th, 2013 in Hong Kong. This conference is sponsored by International Association for Scientific and High Technology and International Science and Engineering Research Center, and it is technical co-sponsored by Trans Tech Publications and Academy Publisher. The conference will continue the excellent tradition of gathering world-class researchers and engineers engaged in the fields of Applied Materials and Electronics Engineering to meet and present their latest activities. You are cordially invited to attend this interesting event. ?

AMEE 2012, the 1st International Conference on Applied Materials and Electronics Engineering (AMEE 2012) has successfully taken place in Hong Kong, China, January 18-19, 2012 . All accepted papers from this conference have been published on Advanced Materials Research and indexed by EI Compendex, Thomson ISTP and Elsevier SCOPUS. (EI Detail)

AMEE 2013, All accepted papers will be published in the Advanced Materials Research (ISSN:1022-6680). (Indexed by Elsevier: SCOPUS and Ei Compendex (CPX) Cambridge Scientific Abstracts (CSA), Chemical Abstracts (CA), Google and Google Scholar, ISI (ISTP, CPCI, Web of Science), Institution of Electrical Engineers (IEE), etc.)

The modified and extended excellence papers will be published by the special issues for the following Journals:
International Journal of Materials and Product Technology (IJMPT, SCIE, SciSearch, Impact Factor: 0.258)
Materials Science (ISSN 2083–134X,SCIE, SciSearch, Impact Factor of 0.366 )
International Journal of Simulation and Process Modelling(IJSPM, EI Compendex)


2013 AMEE Workshop on Civil Engineering and Materials Science (CEMS 2013)

2013 AMEE Workshop on Chemical and Materials Engineering (CME 2013)

2013 AMEE Workshop on Environmental Engineering and Materials Science (EEMS 2013)


Area 1
Material Science and Technology / 材料科学与技术
Building Materials/ 建筑材料
Nanoscience and Nanotechnology / 纳米科学与技术
MEMS/NEMS / 微型/纳米机电系统
Other / 其他相关领域

Area 2
Electrical Engineering/电子工程
Communications and Networking/通信和网络
Computer /计算机
Information Management and Information System / 信息管理和信息系统
Automatic Control / 自动控制
Mechatronics / 机电一体化
Other /其他相关领域

AMEE 2013 invites authors to submit original and unpublished work. Papers should cover 4-5 pages Template (Download Word). All submitted papers should be written in English. Each paper will be reviewed by 2-3 reviewers. Submission implies the willingness of at least one of the authors to register the work. Papers should be submitted to us by Online Submission.

Contact us
For further information, please contact the Secretariat of the Organizing Committee:

Email: ;

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