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ICEPT-HDP 2012 : 13th International Conference on Electronic Packaging Technology & High Density Packaging

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Link: http://www.icept.org
 
When Aug 13, 2012 - Aug 16, 2012
Where Guilin, China
Submission Deadline Mar 16, 2012
Categories    electronic packaging
 

Call For Papers

The 13th International Conference on Electronic Packaging Technology &High Density Packaging (ICEPT-HDP 2012) will be held in Guilin, China,from August 13 to 16, 2012. The ICEPT-HDP 2012 is organized by Electronic Manufacturing and Packaging Technology Society (EMPT) of Chinese Institute of Electronics (CIE) and co-organized by Guilin Universityof Electronic Technology. As one of the most famous international conferences on electronic packaging technology, the conference has receivedstrong support from IEEE CPMT and active involvement from IMAPS,ASME and iNEMI, and was highly appreciated by China Institute of Electronics and China Association for Science and Technology (CAST).

ICEPT-HDP 2012 is a four-day event, featuring technical sessions, invitedt alks, professional development courses/forums, exhibition, and social networking activities. It aims to cover the latest technological developments in electronic packaging, manufacturing and packaging equipment, and provide opportunities to explore the trends of research and development, as well as business in China. We are looking forward to receiving your papers and meeting you at the conference.

CONFERENCE THEMES

· Advanced Packaging & System Integration: BGA, CSP, flip chip; WLP, SiP; TSV, 3D integration; and other advanced packaging and system integration technologies.

· Packaging Materials & Processes: Green materials, nano-materials and other novel materials for packaging performance enhancement and cost reduction; and various new packaging/assembly processes.

· Packaging Design and Modeling: New packaging/assembly designs; methodologies for modeling, simulation and validation of electrical, thermal, optical and mechanical performance of various electronics packages; multi-scale and multi-physics modeling.

· High Density Substrate & SMT:Substrate with embedded passives and active components; HDI substrate, PCB, high performance multi-layer substrate; and various novel assembly technologies that improve substrate density and performance.

· Advanced Manufacturing Technologies and Packaging Equipment: Packaging/assembly equipment; measurement techniques; novel packaging/assembly technologies for manufacturability and yield improvement.

· Quality & Reliability: Quality monitoring and evaluation; methodologies for accelerated reliability data collection and analysis, reliability modeling and life prediction; failure analysis and non-destructive diagnose.

· Solid State Lighting Packaging & Integration: CoB, WLP and other advanced packaging/integration technologies; methodologies for design, manufacturing and testing of high power LED module; LED packaging/integration technologies and their applications in LCD, micro-projector, in-door lighting, street lamp, etc.

· Emerging Technologies: Packaging technologies for sensors, actuators, MEMS, NEMS and MOEMS; optoelectronics packaging; packaging/integration technologies and their applications in LCD, passive & RF devices, power & HV devices, nano-devices, etc.

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