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ISCDG 2012 : International Semiconductor Conference Dresden-Grenoble

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Link: http://iscdg2012.insight-outside.fr
 
When Sep 24, 2012 - Sep 26, 2012
Where Grenoble, France
Submission Deadline Apr 30, 2012
Notification Due Jun 1, 2012
Categories    semiconductor
 

Call For Papers

International Semiconductor Conference Dresden-Grenoble (ISCDG)

Grenoble and Dresden are the two major European Semiconductor Research, Development and Production sites. In the preceeding editions of 2009 and 2011, the conference was named “Semiconductor Conference Dresden”. The objective of the ISCDG is to enhance the visibility of both cities international excellence.
The 2012 ISCDG will be held in Grenoble for the first time. The venue will be alternating in Grenoble and Dresden every other year.


Main areas covered by the conference : Materials, devices and systems science, engineering and architectures and their characterization

Integrated Circuit and System Design
Mixed-signal, analogue and digital circuits and systems for high speed and/or low power consumption, adaptive power management, RF up to sub-THz, low costs, and advanced performance and density, circuits in More than Moore and Beyond Moore technologies. Manufacturing challenges (cost and cycle time reduction, test, wafer –prime - production.etc..)

More Moore and Beyond Moore Devices Technologies and Architectures
Ultimate CMOS (Silicon and Strained IV-IV alloys on insulator, multi-gate and channels transistors, III-V channels), nanowires; Thin films dielectrics: High-K and Low-K; nano-materials; Beyond Moore: TunFETs, carbon electronics,…

Memory technologies
Sand alone and Embedded Memory Technologies, New memory technologies: RRAMs, CBRAMs, MRAMs, 1T DRAM, …

More than Moore technologies
MEMS, NEMS, power devices (GaN, GaP), RF and analog passive components (MIM, filters, supercapacitors, inductances, …); Spintronics based devices; Bio sensors, Imagers, thermoelectric, energy harvesting…

Interconnection and Packaging Technologies
3-D and novel interconnects, Wire bonding, flip chip, solder replacement flip chip, under bump metallurgy, high density substrates, New packaging technologies for single chip, multi-chip, wafer level, power and stacked-die packages, Wafer bumping and thinning, …

Optical Devices and Photonics
Optical component assemblies, electro-optical modules, waveguides, silicon based photonic devices, organic devices, optical materials

Organic and flexible electronics
polymer and organic, ink-jet printed electronics, organic PV and PV in organic, OLEDs, …

Characterization, Quality and Reliability
Electrical characterization, testing strategies and protocols, physical characterization for process development and process control. Component, board and system level reliability assessment, failure analysis, interfacial adhesion, accelerated testing and models, component and system qualification.

Modeling and Simulation
EDA, TCAD, electrical, thermal, thermo-mechanical, reliability, optical, modeling and simulation for devices, component and system level applications.


Key dates
Paper submission deadline April 30, 2012
Paper acceptance June 1, 2012
Deadline for early bird registration (accommodation, conference and short course fees) August 15, 2012

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