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EMIE 2026 : 2026 6th International Conference on Electronic Materials and Information Engineering

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Link: https://ais.cn/u/RrIzUf
 
When Jul 17, 2026 - Jul 19, 2026
Where Harbin, China
Submission Deadline Jun 10, 2026
Final Version Due Jul 10, 2026
Categories    electronics   materials   information engineering   communications
 

Call For Papers

2026 6th International Conference on Electronic Materials and Information Engineering (EMIE 2026) will be held in Harbin, China from July 17 to 19, 2026.

๐—–๐—ผ๐—ป๐—ณ๐—ฒ๐—ฟ๐—ฒ๐—ป๐—ฐ๐—ฒ ๐—ช๐—ฒ๐—ฏ๐˜€๐—ถ๐˜๐—ฒ: https://ais.cn/u/RrIzUf

---๐—–๐—ฎ๐—น๐—น ๐—ณ๐—ผ๐—ฟ ๐—ฝ๐—ฎ๐—ฝ๐—ฒ๐—ฟ๐˜€---
The topics of interest for submission include, but are not limited to:
โ—•Electronic materials
Physical chemistry
Semiconductor material
Conductive metals and their alloys
Electromagnetic shielding material
Dielectric material
Piezoelectric and ferroelectric materials
Magnetic material
Optoelectronic material
Integrated circuit

โ—•Information engineering:
Electronic science and technology
Information and communication Engineering
Optoelectronic information science and technology
Engineering optics
Information optics
Electronic technology
Photoelectric technology
Communication technology
Measurement and control technology
Computer application technology

---๐—ฆ๐—ฝ๐—ฒ๐—ฎ๐—ธ๐—ฒ๐—ฟ๐˜€---
Prof. Jiankun Hu,IEEE Fellow,The University of New South Wales (UNSW), Australia
Prof. Lei Zhang,Nanjing University of Information Science and Technology, China

---๐—ฃ๐˜‚๐—ฏ๐—น๐—ถ๐—ฐ๐—ฎ๐˜๐—ถ๐—ผ๐—ป---
All papers, both invited and contributed, will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers of EMIE 2026 will be published in SPIE - The International Society for Optical Engineering (ISSN: 0277-786X), and indexed by EI Compendex and Scopus.

---๐—œ๐—บ๐—ฝ๐—ผ๐—ฟ๐˜๐—ฎ๐—ป๐˜ ๐——๐—ฎ๐˜๐—ฒ๐˜€---
Submission Deadline: June 10, 2026
Registration Deadline: July 3, 2026
Final Paper Submission Date: July 10, 2026
Conference Dates: July 17-19, 2026

---๐—ฃ๐—ฎ๐—ฝ๐—ฒ๐—ฟ ๐—ฆ๐˜‚๐—ฏ๐—บ๐—ถ๐˜€๐˜€๐—ถ๐—ผ๐—ป---
Please send the full paper(word+pdf) to Submission System:
https://ais.cn/u/RrIzUf

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