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AMCE 2026 : 2026 6th International Conference on Advanced Materials and Chemical Engineering

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Link: https://ais.cn/u/ArmQzy
 
When Jul 17, 2026 - Jul 19, 2026
Where Guangzhou, China
Submission Deadline Jun 10, 2026
Final Version Due Jun 30, 2026
Categories    materials   chemical engineering   high performance computing   nanotechnology
 

Call For Papers

2026 6th International Conference on Advanced Materials and Chemical Engineering (AMCE 2026) will be held in-person from July 17 to 19, 2026, in Guangzhou, China.

𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 𝗪𝗲𝗯𝘀𝗶𝘁𝗲: https://ais.cn/u/ArmQzy

---𝗖𝗮𝗹𝗹 𝗳𝗼𝗿 𝗽𝗮𝗽𝗲𝗿𝘀---
The topics of interest for submission include, but are not limited to:
◕ New Materials
►Nano Materials and Technology,
►Magnetic Materials
►Superconducting Materials
►New Semiconductor Materials
►A New Generation of Amorphous Materials
►Nano Powder Materials
►Graphene
►Superconducting Materials and Raw Materials
►Smart Materials

◕ Material Physical Chemistry
►Dielectric Superlattice and its Microstructure Materials and Devices
►Dielectric, Ferroelectric thin Films and Integrated Devices
►Artificial Band Gap Materials
►All-oxide Heterostructures and Devices
►Nanomaterials and Nanoelectronics
►New Functions Inorganic non-metallic Materials, Microstructure Material Design
►High-performance Computing in Material Design
►Nonlinear Photonics
►Controlled Synthesis and Assembly of Low-dimensional Nanomaterials
►Nanophotonics Materials, etc.
►Colloid and Interface Chemistry
►Electrochemistry and Biosensors
►Data Physical Chemistry
►Nanotechnology, etc.

---𝗦𝗽𝗲𝗮𝗸𝗲𝗿𝘀---
Prof. Guohua Xie,Xiamen University, China
Prof. Guiyin Li,Guangdong University of Petrochemical Technology, China

---𝗣𝘂𝗯𝗹𝗶𝗰𝗮𝘁𝗶𝗼𝗻---
All accepted full papers will be published in the conference proceedings and will be submitted to EI Compendex / Scopus for indexing.

---𝗜𝗺𝗽𝗼𝗿𝘁𝗮𝗻𝘁 𝗗𝗮𝘁𝗲𝘀---
Full Paper Submission Date: June 10, 2026
Registration Deadline: June 20, 2026
Final Paper Submission Date: June 30, 2026
Conference Dates: July 17-19, 2026

---𝗣𝗮𝗽𝗲𝗿 𝗦𝘂𝗯𝗺𝗶𝘀𝘀𝗶𝗼𝗻---
Please send the full paper(word+pdf) to Submission System:
https://ais.cn/u/ArmQzy

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