17th International Conference on VLSI (VLSI 2026)
November 27 ~ 28, 2026, Zurich, Switzerland
Scope & Topics
17th International Conference on VLSI (VLSI 2026) will provide an excellent international forum for sharing knowledge and results in theory, methodology and applications of VLSI. Original, unpublished papers, describing research in the general area of VLSI are solicited. Both theoretical and experimental research results are welcome in the following areas, but are not limited to. The conference focuses on all technical and practical aspects of high performance computing, green computing, pervasive computing, cloud computing etc.
Authors are solicited to contribute to the conference by submitting articles that illustrate research results, projects, surveying works and industrial experiences that describe significant advances in the areas of Computer Science, Engineering and Applications
Topics of interest include, but are not limited to, the following
- VLSI Design
- Analog, Digital and Mixed Signal ICs
- RF, mmWave and THz Circuits
- Low Power and Energy Efficient Design
- High Performance and HPC Circuits
- Analog AI and In Sensor Computing
- Compute in Pixel Architectures
- Computer Aided Design (CAD)
- AI Driven Physical Design
- Autonomous EDA Agents
- Generative EDA Models
- EDA Foundation Models
- AI Driven Analog Layout Automation
- Lithography Aware Design
- High NA EUV Co Design
- Testing and Testability
- Reliability, Aging and Variability
- AI Accelerator Reliability
- Fault Tolerance and Resilient Architectures
- Post Silicon Validation
- AI Driven Yield Optimization
- Hardware Security and Trusted Computing
- Side Channel and Fault Injection Resistance
- AI Enhanced Side Channel Analysis
- ML Driven Hardware Attacks
- Secure SoCs, Crypto Accelerators and PUFs
- Chiplet Supply Chain Security
- Emerging Technologies
- Carbon Nanotube, Graphene and 2D Materials
- Spintronics, TFETs and Novel Transistors
- Quantum and Cryogenic CMOS
- Cryo CMOS for Quantum Control
- Superconducting Logic and SFQ Circuits
- Photonic and Optoelectronic Circuits
- Photonic AI Accelerators
- Optical Neural Networks
- Chiplet Based Architectures
- 3D IC and TSV Integration
- Monolithic 3D Integration
- Microfluidic and Liquid Cooled 3D ICs
- Thermal Mechanical Co Design
- Backside Power Delivery Networks
- RISC V Hardware and SoCs
- Wafer Scale AI Systems
- AI/ML Hardware Accelerators
- Hardware for LLMs and Foundation Models
- Memory Centric LLM Accelerators
- Sparse and Low Precision AI Hardware
- Emerging Memory Technologies
- In Memory Computing
- AI Optimized Memory Hierarchies
- Near Memory AI Processing
- LLM Centric Memory Subsystems
- High Bandwidth Interconnects and NoCs
- VLSI for Communications and 6G
- VLSI for Video, Imaging and Vision
- VLSI for Security and Cryptography
- VLSI for Sensor Networks and IoT
- Biomedical and Wearable VLSI
- Green Semiconductor Manufacturing
- Carbon Neutral Chip Design
- Energy Efficient Packaging
Paper Submission
Authors are invited to submit papers through the conference Submission System by November 14, 2026 . Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of the conference will be published by The proceedings of the conference will be published by Computer Science Conference Proceedings in Computer Science & Information Technology (CS & IT) series (Confirmed).
Selected papers from VLSI 2026, after further revisions, will be published in the special issue of the following journals.
Important Dates
| Submission Deadline | : | November 14, 2026 |
| Authors Notification | : | November 17, 2026 |
| Final Manuscript Due | : | November 20, 2026 |
Co - Located Event
***** The invited talk proposals can be submitted to vlsi@dppr2026.org
